Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability
January 22, 2026
Chiplet Technical Papers Archive - Page 2 of 12
EOTPR Fine Pitch Probing for Die-to-Die Interconnect Failure Analysis
January 21, 2026
InterPUF: Distributed Authentication via Physically Unclonnable Functions and Multi-party Computation for Reconfigurable Interposers
January 20, 2026
Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging
January 19, 2026
The Road to 64G UCIe IP: What Designers Need to Know
January 14, 2026
Development and Optimization of Fine-Pitch RDL for RDL Interposer, and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology
January 13, 2026
Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
January 7, 2026
High-Efficient and Fast-Response Thermal Management by Heterogeneous Integration of Diamond on Interposer-Based 2.5D Chiplets
January 5, 2026
HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement
January 5, 2026
A physics-constrained and data-driven approach for thermal field inversion in chiplet-based packaging
December 30, 2025
Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy
December 24, 2025
Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review
December 22, 2025
LaMoSys3.5D: Enabling 3.5D-IC-Based Large Language Model Inference Serving Systems via Hardware/Software Co-Design
December 11, 2025
3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems
December 9, 2025
Compass: Mapping Space Exploration for Multi-Chiplet Accelerators Targeting LLM Inference Serving Workloads
December 9, 2025
Chiplet technology for large-scale trapped-ion quantum processors
December 3, 2025
REX: A Remote Execution Model for Continuos Scalability in Multi-Chiplet-Module GPUs
December 3, 2025
A 3D-integrated BiCMOS-silicon photonics high-speed receiver realized using micro-transfer printing
December 3, 2025
AccelStack: A Cost-Driven Analysis of 3D-Stacked LLM Accelerators
November 26, 2025
ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC
November 25, 2025
