Memory & Storage Chiplet-Ready IP

Memory & Storage Chiplet-Ready IP provide the foundational data bandwidth, capacity, and latency required by modern heterogeneous computing systems. By disaggregating memory functions into dedicated chiplets, system architects can independently scale compute and memory while optimizing performance, power efficiency, and cost.

This category includes memory chiplets (HBM, SRAM, NVM), memory controllers, and memory PHY chiplets, supporting a wide range of applications such as AI accelerators, HPC platforms, data center servers, and advanced SoCs. Memory chiplets play a critical role in feeding high-performance compute dies with sustained bandwidth while minimizing energy per bit.

Designed for integration in 2.5D and 3D packaging architectures, Memory & Storage chiplets are commonly paired with high-bandwidth die-to-die interconnects and advanced substrates. This modular approach enables flexible memory hierarchies, faster technology adoption, and improved system scalability in next-generation AI and data-centric architectures.