Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture
2026-09-15 13:18:00
Ecosystem Highlights
Chiplet-Based FPGAs Optimize Performance for Space Applications
2026-09-10 18:44:00
Crealights and GlobalFoundries Deepen Global Strategic Partnership
2026-09-08 07:24:16
Recent Updates
Micas Networks Expands Company-Operated Manufacturing to Scale Commercial CPO
2026-09-16 13:37:39
Manufacturing & Supply Chain
Polaris Electro-Optics Secures $50M Series B to Scale Next-Gen Optical Engine Platform for AI Infrastructure
2026-09-16 05:51:00
Business & Deals
Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture
2026-09-15 13:18:00
Chiplet-Ready IP
Fujitsu launches made-in-Japan next-generation CPU FUJITSU-MONAKA and Fujitsu MONAKA Server for sovereign AI infrastructure
2026-09-15 06:47:22
Chiplet-Based Chips
Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem
2026-09-15 06:17:41
Ecosystem & Strategy
Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP
2026-09-14 18:38:24
Design, Tools & Validation
Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026
2026-09-14 14:46:48
Misc
NcodiN Appoints Carlo Guareschi as Chief Business Officer, Yacine Halioua as Chief Product Officer, and Zachary Cho as General Manager, France
2026-09-14 11:23:00
Misc
Chiplet-Based FPGAs Optimize Performance for Space Applications
2026-09-10 18:44:00
Analysis & Commentary
Ayar Labs Expands 2026 Funding to $650 Million to Scale Manufacturing-Ready CPO for AI Scale-Up Beyond the Rack
2026-09-10 13:24:10
Business & Deals
From pilot line to industrial implementation: FIRST by FMD brings together decision-makers for Europe’s semiconductor future
2026-09-10 11:33:00
Ecosystem & Strategy
Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion
2026-09-09 05:47:11
Manufacturing & Supply Chain
HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem
2026-09-08 14:42:05
Business & Deals
EdgeCortix Signs Multi-Year, Multimillion-Dollar Agreement with Kawasaki Heavy Industries to Advance Next-Generation AI-Enabled Aerial Defense Systems
2026-09-08 07:40:00
Business & Deals
Crealights and GlobalFoundries Deepen Global Strategic Partnership
2026-09-08 07:24:16
Ecosystem & Strategy
Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects
2026-09-07 11:34:00
Standards & Research
Mercedes Spinout Athos Closes Its Doors
2026-09-02 18:54:00
Analysis & Commentary
NcodiN Appoints Semiconductor Industry Veteran Kiran Burli as Chief Operations Officer
2026-09-02 05:50:14
Misc
EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics
2026-09-01 13:17:00
Interconnects & Integration
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”
2026-09-01 08:14:04
Manufacturing & Supply Chain
Micas Networks Expands Company-Operated Manufacturing to Scale Commercial CPO
2026-09-16 13:37:39
Manufacturing & Supply Chain
Polaris Electro-Optics Secures $50M Series B to Scale Next-Gen Optical Engine Platform for AI Infrastructure
2026-09-16 05:51:00
Business & Deals
Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture
2026-09-15 13:18:00
Chiplet-Ready IP
Fujitsu launches made-in-Japan next-generation CPU FUJITSU-MONAKA and Fujitsu MONAKA Server for sovereign AI infrastructure
2026-09-15 06:47:22
Chiplet-Based Chips
Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem
2026-09-15 06:17:41
Ecosystem & Strategy
Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP
2026-09-14 18:38:24
Design, Tools & Validation
Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026
2026-09-14 14:46:48
Misc
NcodiN Appoints Carlo Guareschi as Chief Business Officer, Yacine Halioua as Chief Product Officer, and Zachary Cho as General Manager, France
2026-09-14 11:23:00
Misc
Chiplet-Based FPGAs Optimize Performance for Space Applications
2026-09-10 18:44:00
Analysis & Commentary
Ayar Labs Expands 2026 Funding to $650 Million to Scale Manufacturing-Ready CPO for AI Scale-Up Beyond the Rack
2026-09-10 13:24:10
Business & Deals
From pilot line to industrial implementation: FIRST by FMD brings together decision-makers for Europe’s semiconductor future
2026-09-10 11:33:00
Ecosystem & Strategy
Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion
2026-09-09 05:47:11
Manufacturing & Supply Chain
HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem
2026-09-08 14:42:05
Business & Deals
EdgeCortix Signs Multi-Year, Multimillion-Dollar Agreement with Kawasaki Heavy Industries to Advance Next-Generation AI-Enabled Aerial Defense Systems
2026-09-08 07:40:00
Business & Deals
Crealights and GlobalFoundries Deepen Global Strategic Partnership
2026-09-08 07:24:16
Ecosystem & Strategy
Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects
2026-09-07 11:34:00
Standards & Research
Mercedes Spinout Athos Closes Its Doors
2026-09-02 18:54:00
Analysis & Commentary
NcodiN Appoints Semiconductor Industry Veteran Kiran Burli as Chief Operations Officer
2026-09-02 05:50:14
Misc
EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics
2026-09-01 13:17:00
Interconnects & Integration
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”
2026-09-01 08:14:04
Manufacturing & Supply Chain