POET Technologies and Lumilens Advance Wafer-Level Photonic Integration for Next-Generation AI Optical Networks
2026-05-14 13:35:24
Ecosystem Highlights
Recent Updates
POET Technologies and Lumilens Advance Wafer-Level Photonic Integration for Next-Generation AI Optical Networks
2026-05-14 13:35:24
Interconnects & Integration
Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
2026-05-13 13:26:00
Interconnects & Integration
IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
2026-05-12 11:26:31
Interconnects & Integration
EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
2026-05-12 11:18:53
Chiplet-Ready IP
NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando
2026-05-12 05:46:00
Standards & Research
Wooptix Targets AI Packaging Bottleneck with Astronomy Tech
2026-05-11 12:18:00
Analysis & Commentary
Kenyi Technologies to collaborate with ADTechnology to co-develop a Server Processor targeting Edge AI and Telco use cases
2026-05-09 05:46:15
Ecosystem & Strategy
Tawazun and Lockheed Martin Sign Strategic Agreement to Establish UAE's Chiplet Design and Assembly Facility
2026-05-09 05:34:00
Ecosystem & Strategy
Xanadu and EV Group partner to build industrial-scale photonic quantum hardware
2026-05-05 15:09:09
Ecosystem & Strategy
AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants
2026-05-05 11:53:54
Analysis & Commentary
GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
2026-05-04 13:22:34
Interconnects & Integration
TSMC SoIC roadmap targets 2029 chip stacking
2026-05-04 07:26:44
Analysis & Commentary
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
2026-05-04 06:02:06
Business & Deals
AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity
2026-05-02 05:36:26
Analysis & Commentary
SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
2026-05-01 05:52:37
Design, Tools & Validation
Athos Scraps Multi-Vendor Roadmap, Plans Chiplet Tape-Out
2026-04-30 18:47:00
Analysis & Commentary
LTSCT Joins imec Automotive Chiplet Program
2026-04-29 06:19:00
Ecosystem & Strategy
CEA-Leti Will Present Its Latest Advances On Next-Generation Chip Integration at ECTC 2026
2026-04-29 06:00:35
Design, Tools & Validation
OpenLight Secures $50 Million in Series A-1 Funding to Accelerate Global Deployment of Next-Generation Photonics
2026-04-28 13:40:39
Business & Deals
Lightmatter Names Roy Kim Vice President of Product to Lead Global Deployment of Photonic Interconnects
2026-04-27 13:35:03
Ecosystem & Strategy
POET Technologies and Lumilens Advance Wafer-Level Photonic Integration for Next-Generation AI Optical Networks
2026-05-14 13:35:24
Interconnects & Integration
Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
2026-05-13 13:26:00
Interconnects & Integration
IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
2026-05-12 11:26:31
Interconnects & Integration
EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
2026-05-12 11:18:53
Chiplet-Ready IP
NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando
2026-05-12 05:46:00
Standards & Research
Wooptix Targets AI Packaging Bottleneck with Astronomy Tech
2026-05-11 12:18:00
Analysis & Commentary
Kenyi Technologies to collaborate with ADTechnology to co-develop a Server Processor targeting Edge AI and Telco use cases
2026-05-09 05:46:15
Ecosystem & Strategy
Tawazun and Lockheed Martin Sign Strategic Agreement to Establish UAE's Chiplet Design and Assembly Facility
2026-05-09 05:34:00
Ecosystem & Strategy
Xanadu and EV Group partner to build industrial-scale photonic quantum hardware
2026-05-05 15:09:09
Ecosystem & Strategy
AI Optical Interconnect Boom Drives U.S. Firms to Expand Southeast Asia Outsourcing, Opening the Door for Cross-Industry Entrants
2026-05-05 11:53:54
Analysis & Commentary
GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution
2026-05-04 13:22:34
Interconnects & Integration
TSMC SoIC roadmap targets 2029 chip stacking
2026-05-04 07:26:44
Analysis & Commentary
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
2026-05-04 06:02:06
Business & Deals
AI Competition Turns into a Supply Chain Arms Race, Tightening Advanced Packaging and 3nm Capacity
2026-05-02 05:36:26
Analysis & Commentary
SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
2026-05-01 05:52:37
Design, Tools & Validation
Athos Scraps Multi-Vendor Roadmap, Plans Chiplet Tape-Out
2026-04-30 18:47:00
Analysis & Commentary
LTSCT Joins imec Automotive Chiplet Program
2026-04-29 06:19:00
Ecosystem & Strategy
CEA-Leti Will Present Its Latest Advances On Next-Generation Chip Integration at ECTC 2026
2026-04-29 06:00:35
Design, Tools & Validation
OpenLight Secures $50 Million in Series A-1 Funding to Accelerate Global Deployment of Next-Generation Photonics
2026-04-28 13:40:39
Business & Deals
Lightmatter Names Roy Kim Vice President of Product to Lead Global Deployment of Photonic Interconnects
2026-04-27 13:35:03
Ecosystem & Strategy