Kandou AI Demonstrates Revolutionary 260 Gbps Tigerwing™ Chip-to-Chip Interface in Silicon at 2026 TSMC Europe Technology Symposium
2026-06-04 11:53:00
Ecosystem Highlights
Photonics: A Foundational Scaling Layer for AI-Era Computing
2026-06-03 05:36:00
Sivers & GlobalFoundries Advance AI Data Center Optical Solutions
2026-06-02 16:35:00
Recent Updates
JCET Opens New High-Density 3D System Integration Facility
2026-06-04 13:36:27
Manufacturing & Supply Chain
Kandou AI Demonstrates Revolutionary 260 Gbps Tigerwing™ Chip-to-Chip Interface in Silicon at 2026 TSMC Europe Technology Symposium
2026-06-04 11:53:00
Interconnects & Integration
InPsytech Highlights UCIe Innovation at COMPUTEX with UCIe Live Demo and Ultra-high speed ONFI 6400 Development
2026-06-04 08:02:00
Chiplets
Photonics: A Foundational Scaling Layer for AI-Era Computing
2026-06-03 05:36:00
Analysis & Commentary
Ayar Labs Joins NVIDIA NVLink™ Fusion Ecosystem to Bring Co-Packaged Optics to Rack-Scale AI Infrastructure
2026-06-03 05:23:35
Interconnects & Integration
Lightmatter Joins NVIDIA NVLink Fusion and Powers Next-Generation AI Infrastructure with Photonic Interconnects
2026-06-03 05:17:28
Interconnects & Integration
Sivers & GlobalFoundries Advance AI Data Center Optical Solutions
2026-06-02 16:35:00
Interconnects & Integration
Wiwynn and Ecosystem Partners to Showcase Co-Packaged Optics Innovations at Computex 2026
2026-06-01 05:45:19
Interconnects & Integration
CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware
2026-05-29 11:06:59
Standards & Research
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
2026-05-29 05:23:06
Other
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
2026-05-28 18:42:51
Design, Tools & Validation
Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand
2026-05-28 18:33:38
Interconnects & Integration
Credo Completes Acquisition of DustPhotonics
2026-05-28 13:33:00
Business & Deals
Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy
2026-05-28 11:34:38
Standards & Research
Chiplets, Ecosystems, and Europe’s Post-Fab Semiconductor Strategy
2026-05-28 09:11:09
Analysis & Commentary
FuriosaAI Partners with Broadcom to Build Next-generation Inference Platform for the Agentic Era
2026-05-27 14:10:51
Interconnects & Integration
Skymizer and VIA NEXT Collaborate to Advance Next-Generation AI Inference Infrastructure and Chiplet Integration Ecosystem
2026-05-27 05:33:30
Chiplet-Ready IP
Altera to Develop Reconfigurable Coherent Optical Communications Modem Prototype for DIU RAZORBAC Program
2026-05-26 20:01:30
Interconnects & Integration
Fujifilm Presents Latest Advanced Packaging Research Results and Will Introduce PFAS-Free PBO at ECTC 2026
2026-05-26 16:58:06
Interconnects & Integration
NcodiN Appoints Co-Founder Fabrice Raineri as Chief Technology Officer
2026-05-26 15:33:10
Other
JCET Opens New High-Density 3D System Integration Facility
2026-06-04 13:36:27
Manufacturing & Supply Chain
Kandou AI Demonstrates Revolutionary 260 Gbps Tigerwing™ Chip-to-Chip Interface in Silicon at 2026 TSMC Europe Technology Symposium
2026-06-04 11:53:00
Interconnects & Integration
InPsytech Highlights UCIe Innovation at COMPUTEX with UCIe Live Demo and Ultra-high speed ONFI 6400 Development
2026-06-04 08:02:00
Chiplets
Photonics: A Foundational Scaling Layer for AI-Era Computing
2026-06-03 05:36:00
Analysis & Commentary
Ayar Labs Joins NVIDIA NVLink™ Fusion Ecosystem to Bring Co-Packaged Optics to Rack-Scale AI Infrastructure
2026-06-03 05:23:35
Interconnects & Integration
Lightmatter Joins NVIDIA NVLink Fusion and Powers Next-Generation AI Infrastructure with Photonic Interconnects
2026-06-03 05:17:28
Interconnects & Integration
Sivers & GlobalFoundries Advance AI Data Center Optical Solutions
2026-06-02 16:35:00
Interconnects & Integration
Wiwynn and Ecosystem Partners to Showcase Co-Packaged Optics Innovations at Computex 2026
2026-06-01 05:45:19
Interconnects & Integration
CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware
2026-05-29 11:06:59
Standards & Research
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
2026-05-29 05:23:06
Other
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
2026-05-28 18:42:51
Design, Tools & Validation
Cadence and Samsung Foundry Deepen 2nm and 3D‑IC Collaboration to Meet Surging AI Infrastructure and Physical AI Demand
2026-05-28 18:33:38
Interconnects & Integration
Credo Completes Acquisition of DustPhotonics
2026-05-28 13:33:00
Business & Deals
Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy
2026-05-28 11:34:38
Standards & Research
Chiplets, Ecosystems, and Europe’s Post-Fab Semiconductor Strategy
2026-05-28 09:11:09
Analysis & Commentary
FuriosaAI Partners with Broadcom to Build Next-generation Inference Platform for the Agentic Era
2026-05-27 14:10:51
Interconnects & Integration
Skymizer and VIA NEXT Collaborate to Advance Next-Generation AI Inference Infrastructure and Chiplet Integration Ecosystem
2026-05-27 05:33:30
Chiplet-Ready IP
Altera to Develop Reconfigurable Coherent Optical Communications Modem Prototype for DIU RAZORBAC Program
2026-05-26 20:01:30
Interconnects & Integration
Fujifilm Presents Latest Advanced Packaging Research Results and Will Introduce PFAS-Free PBO at ECTC 2026
2026-05-26 16:58:06
Interconnects & Integration
NcodiN Appoints Co-Founder Fabrice Raineri as Chief Technology Officer
2026-05-26 15:33:10
Other