Scintil Photonics, Presto Engineering and CEA-Leti Receive Bpifrance Grant for the CanopAI Project to Advance Photonic Integration for AI and Data Centers
2026-01-22 14:22:43
Ecosystem Highlights
YorChip and Sofics Expand UCIe PHY Across TSMC Nodes
2026-01-21 12:13:53
JCET Delivers Silicon Photonics Engine Samples, Marks CPO Milestone
2026-01-21 06:47:46
Recent Updates
Scintil Photonics, Presto Engineering and CEA-Leti Receive Bpifrance Grant for the CanopAI Project to Advance Photonic Integration for AI and Data Centers
2026-01-22 14:22:43
Interconnects & Integration
Wave Photonics Brings CSA Catapult’s Wafer-Scale PIC Testing to Its PDK Management Platform
2026-01-22 06:25:00
Design, Tools & Validation
Co-packaged Optics and Optical Interconnects: A Global Picture of the IP Competition
2026-01-21 12:34:49
Standards & Research
YorChip and Sofics Expand UCIe PHY Across TSMC Nodes
2026-01-21 12:13:53
Chiplet-Ready IP
JCET Delivers Silicon Photonics Engine Samples, Marks CPO Milestone
2026-01-21 06:47:46
Interconnects & Integration
Diamond Quanta Announces Adamantine Thermal™, Extending Its Advanced Packaging Roadmap Following CES 2026
2026-01-19 14:32:40
Manufacturing & Supply Chain
Baya Systems Expands Bengaluru Engineering Hub to Scale AI, Automotive and HPC Innovation
2026-01-15 06:47:35
Business & Deals
NewPhotonics® Introduces Industry-First Serviceable Near-Packaged Optics (NPO) Chiplet Solution with Interoperability for 1.6T
2026-01-13 12:31:20
Interconnects & Integration
CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
2026-01-12 07:20:00
Business & Deals
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
2026-01-06 14:16:00
Ecosystem & Strategy
Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
2026-01-06 12:30:00
Chiplets
TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
2026-01-06 08:04:47
Chiplets
Where co-packaged optics (CPO) technology stands in 2026
2025-12-30 18:22:01
Analysis & Commentary
Qualcomm Completes Acquisition of Alphawave Semi
2025-12-18 10:33:00
Business & Deals
Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology
2025-12-18 07:23:00
Chiplet-Ready IP
Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets
2025-12-17 07:48:00
Standards & Research
SEMIFIVE Strengthens AI ASIC Market Position Through IPO “Targeting Global Markets with Advanced-nodes, Large-Die Designs, and 3D-IC Technologies”
2025-12-17 07:02:28
Business & Deals
FormFactor Expands Silicon Photonics Test Capabilities With Acquisition of Keystone Photonics
2025-12-17 06:53:00
Business & Deals
NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production
2025-12-16 20:35:23
Interconnects & Integration
PulseForge Announces Availability of PD700 SA – A Semi-Automated Photonic Debonding Tool Optimized for Large-Panel Advanced Packaging
2025-12-16 16:14:43
Interconnects & Integration
Scintil Photonics, Presto Engineering and CEA-Leti Receive Bpifrance Grant for the CanopAI Project to Advance Photonic Integration for AI and Data Centers
2026-01-22 14:22:43
Interconnects & Integration
Wave Photonics Brings CSA Catapult’s Wafer-Scale PIC Testing to Its PDK Management Platform
2026-01-22 06:25:00
Design, Tools & Validation
Co-packaged Optics and Optical Interconnects: A Global Picture of the IP Competition
2026-01-21 12:34:49
Standards & Research
YorChip and Sofics Expand UCIe PHY Across TSMC Nodes
2026-01-21 12:13:53
Chiplet-Ready IP
JCET Delivers Silicon Photonics Engine Samples, Marks CPO Milestone
2026-01-21 06:47:46
Interconnects & Integration
Diamond Quanta Announces Adamantine Thermal™, Extending Its Advanced Packaging Roadmap Following CES 2026
2026-01-19 14:32:40
Manufacturing & Supply Chain
Baya Systems Expands Bengaluru Engineering Hub to Scale AI, Automotive and HPC Innovation
2026-01-15 06:47:35
Business & Deals
NewPhotonics® Introduces Industry-First Serviceable Near-Packaged Optics (NPO) Chiplet Solution with Interoperability for 1.6T
2026-01-13 12:31:20
Interconnects & Integration
CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
2026-01-12 07:20:00
Business & Deals
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
2026-01-06 14:16:00
Ecosystem & Strategy
Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
2026-01-06 12:30:00
Chiplets
TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
2026-01-06 08:04:47
Chiplets
Where co-packaged optics (CPO) technology stands in 2026
2025-12-30 18:22:01
Analysis & Commentary
Qualcomm Completes Acquisition of Alphawave Semi
2025-12-18 10:33:00
Business & Deals
Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology
2025-12-18 07:23:00
Chiplet-Ready IP
Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets
2025-12-17 07:48:00
Standards & Research
SEMIFIVE Strengthens AI ASIC Market Position Through IPO “Targeting Global Markets with Advanced-nodes, Large-Die Designs, and 3D-IC Technologies”
2025-12-17 07:02:28
Business & Deals
FormFactor Expands Silicon Photonics Test Capabilities With Acquisition of Keystone Photonics
2025-12-17 06:53:00
Business & Deals
NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production
2025-12-16 20:35:23
Interconnects & Integration
PulseForge Announces Availability of PD700 SA – A Semi-Automated Photonic Debonding Tool Optimized for Large-Panel Advanced Packaging
2025-12-16 16:14:43
Interconnects & Integration