TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning
February 16, 2026
Chiplet Technical Library
Whitepapers & Technical Articles
Towards Scalable Multi-Chip Wireless Networks with Near-Field Time Reversal
February 11, 2026
Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding
February 11, 2026
Toward Digital Twins in 3D IC Packaging: A Critical Review of Physics, Data, and Hybrid Architectures
February 4, 2026
Videos
2.5 D Heterogeneous Chiplet Packaging Challenge
February 9, 2026
2026 Predictions from Alpahwave Semi, now part of Qualcomm
January 30, 2026
Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
January 21, 2026
The State of Multi-Die: Insights and Customer Requirements
January 12, 2026
Slides
The Right Testing Strategy Can Save Designs
February 24, 2025
Accelerating AI Chip Development with 3D Multi-Die Designs
February 12, 2025
Scaling Connectivity for Chiplet-Based AI Systems
February 11, 2025
5 key reasons… Chiplet (die-2-die) interfaces require specialty I/O circuits and custom ESD protection
February 7, 2025