Chiplet Technical Library

Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration

By Himanandhan Reddy Kottur, University of Florida, Gainesville

June 23, 2026

2.5D Root of Trust: Securing the Chiplet Ecosystem

By Charles Williams, Texas A&M University

June 23, 2026

Plasma Etch Process Optimization for Photonic-Grade Diamond-on-Insulator Substrates and Thickness Evaluation using Colorimetry

By Tianyin Chen, Delft University of Technology

June 19, 2026

CUTh-Solver: GPU-Accelerated Sparse Matrix Solver for High-Resolution Thermal Simulation of 3D ICs

By Chenghan Wang, The Chinese University of Hong Kong

June 18, 2026

Beyond the data pipe: Why connectivity IP is now the system-critical layer in every 3D IC

By Tova Levy (Siemens EDA) & Archana Cheruliyil (Qualcomm)

June 25, 2026

An Automated Interconnect Modeling Framework for Rapid Cryptolet Design Space Exploration

By Austin Rovinski (NYU)

June 24, 2026

DICE: Detailed Inter-Chiplet End-to-End PHY Modeling for Accurate Chiplet Simulation

By Rashid Aligholipour

June 22, 2026

The Evolution Of UCIe

By Mayank Bhatnagar

June 3, 2026

THz/RF Corridors as a General in-package Fabric For Chiplets, HBM, and High-speed Die-die Interconnect

By Socionext

April 14, 2026

In-Field Monitoring of Chiplets via ML-Driven On-Die Telemetry

By ProteanTecs

April 14, 2026

Chiplets for Automotive, Industrial, and Aerospace Applications

By Fraunhofer IIS

March 27, 2026

Designing the Future Today: AI-Driven Multi-Die Design

By Synopsys