Chiplet Technical Library

C2C-Explorer: An Exploration Framework for Chip-to-Chip Interconnect Architectures in LLM Cloud Computing Systems

By Jiayi Li, Peking University

August 12, 2026

ReVolt: Power Delivery Network-Aware Voltage Droop Control for 2.5D PIM Chiplet Architectures

By Vibhanshu Sharma, Washington State University

August 11, 2026

Innovative FA hardware solution to enable system-level debug of 3D ICs

By Lesly Endrinal, Google LLC

August 11, 2026

Hardware Design and Security in the Era of Chiplets and LLMs

By Johann Knechtel, NYU Abu Dhabi

August 6, 2026

The Future of 3D Heterogeneous Integration (3DHI)

By Madhavan Swaminathan

August 13, 2026

Stop Guessing on Multi-Die PG Planning: Let AI Find the IR-Drop Sweet Spot

By Soheil Modirzadeh

August 13, 2026

Arm's Dong Wei on Why Firmware Will Define the Chiplet Ecosystem

By Allyson Klein

August 12, 2026

What's New in UALink? Technical Deep Dive into the Latest UALink Specifications

By Derek Williams (AMD), Dave Brown (AMD), Justin King (AMD), Arun Satyanarayana (Google) and Rob Pelt (AMD)

August 6, 2026

THz/RF Corridors as a General in-package Fabric For Chiplets, HBM, and High-speed Die-die Interconnect

By Socionext

April 14, 2026

In-Field Monitoring of Chiplets via ML-Driven On-Die Telemetry

By ProteanTecs

April 14, 2026

Chiplets for Automotive, Industrial, and Aerospace Applications

By Fraunhofer IIS

March 27, 2026

Designing the Future Today: AI-Driven Multi-Die Design

By Synopsys

March 27, 2026