Modeling, Optimizing and Exploring Multi-Die FPGA Routing Architectures
June 5, 2026
Chiplet Technical Library
Whitepapers & Technical Articles
A 32 Gb/s 0.41 pJ/bit Single-Ended Transmitter with TX-Based-Only Adaptive Crosstalk Cancellation for Ultra-Short-Reach Wireline Applications
June 5, 2026
Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack
June 2, 2026
Dispersion-Engineered Terahertz Silicon Interconnects Enabling Terabit-Scale Data Links
June 1, 2026
Videos
The Evolution Of UCIe
June 3, 2026
Blueprint for AI Hardware But with Instructions: Pre-Validated Chiplet Building Blocks
May 28, 2026
Standardizing System-Level Interoperability for Multi-Vendor Chiplets
Towards wafer-scale optical interconnect relying on Silicon Photonics and advanced 3D assembly
May 20, 2026
Slides
THz/RF Corridors as a General in-package Fabric For Chiplets, HBM, and High-speed Die-die Interconnect
April 14, 2026
In-Field Monitoring of Chiplets via ML-Driven On-Die Telemetry
April 14, 2026
Chiplets for Automotive, Industrial, and Aerospace Applications
March 27, 2026
Designing the Future Today: AI-Driven Multi-Die Design
March 27, 2026