Divide and conquer: Scalable performance and energy in MCM GPUs
October 5, 2026
Chiplet Technical Library
Whitepapers & Technical Articles
A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling
October 5, 2026
QBX: A Compiler for 2-local Qubit Hamiltonian Simulation on Quantum Chiplets
September 29, 2026
U-Can-Inject-Errors (UCIe): A Protocol-Aware Hardware Trojan for FPGA Chiplet Links
September 28, 2026
Videos
Accelerating Chiplet SoC Development with Standards-Based Frameworks and Automated Design Flows
September 30, 2026
Qualcomm's Tony Pialis on Dragonfly and the Data Movement Wall
September 25, 2026
From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands
September 24, 2026
Advancing 3DIC Technologies to Propel AI Innovations
September 23, 2026
Slides
THz/RF Corridors as a General in-package Fabric For Chiplets, HBM, and High-speed Die-die Interconnect
April 14, 2026
In-Field Monitoring of Chiplets via ML-Driven On-Die Telemetry
April 14, 2026
Chiplets for Automotive, Industrial, and Aerospace Applications
March 27, 2026
Designing the Future Today: AI-Driven Multi-Die Design
March 27, 2026