Chiplet Technical Library

Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI

By Hannah Watson, imec

October 26, 2026

Adaptive 3D Chiplet Architecture with Hybrid Wired–Wireless Interconnect for Energy-Efficient Heterogeneous Computing

By Ch. Sreedhar, Shri Venkateshwara University

October 21, 2026

LLM-Augmented Bayesian Optimization with Adaptive Policies for Chiplet Design Space Exploration

By Hang Liu, Zhejiang University

October 14, 2026

Divide and conquer: Scalable performance and energy in MCM GPUs

By Mario Ibáñez Bolado, Universidad de Cantabria

October 5, 2026

The Open Chiplet Economy: Progress, Challenges, and the Road Ahead

By Microchip, Palo Alto Electron, Arm

October 28, 2026

Agile Silicon Will Open Chiplet Architectures Keep Pace with Fast-Evolving AI Dataflows

By Luisa Gonzalez-Guerrero, Lawrence Berkeley National Laboratory

October 27, 2026

One Abstraction, Many Transports: Push-Mode Communication from Chiplet to Rack

By Sai Rahul Chalamalasetti

October 26, 2026

Advancing Chiplet Flexibility Updates in 2.0 OCE Transaction and Link Layer Specification

By Brian Murray

October 23, 2026

THz/RF Corridors as a General in-package Fabric For Chiplets, HBM, and High-speed Die-die Interconnect

By Socionext

April 14, 2026

In-Field Monitoring of Chiplets via ML-Driven On-Die Telemetry

By ProteanTecs

April 14, 2026

Chiplets for Automotive, Industrial, and Aerospace Applications

By Fraunhofer IIS

March 27, 2026

Designing the Future Today: AI-Driven Multi-Die Design

By Synopsys