Chiplet Technical Library

CCD-Level and Load-Aware Thread Orchestration for In-Memory Vector ANNS on Multi-Core CPUs

By Yuchen Huang, East China Normal University

May 15, 2026

A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs

By Baibhari Priya Barua, University of Tennessee

May 13, 2026

Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems

By Giorgio Di Natale, Univ. Grenoble Alpes

May 12, 2026

Affinity Tailor: Dynamic Locality-Aware Scheduling at Scale

By Jin Xin Ng, Google

May 4, 2026

Chiplets Modularity for AI and HPC

By Patricia González Guerrero

May 6, 2026

Athos Silicon mSoC™ | A New Compute Architecture for Physical AI

By Athos Silicon

May 6, 2026

Cadence & Samsung: Chiplet Ecosystem Innovation for Edge AI | CadenceLive 2026

By Mick Posner, Cadence and Kevin Yee, Samsung Foundry

May 2, 2026

How to accelerate innovation in IC technology with chiplets and 3D ICs

By

April 30, 2026

THz/RF Corridors as a General in-package Fabric For Chiplets, HBM, and High-speed Die-die Interconnect

By Socionext

April 14, 2026

In-Field Monitoring of Chiplets via ML-Driven On-Die Telemetry

By ProteanTecs

April 14, 2026

Chiplets for Automotive, Industrial, and Aerospace Applications

By Fraunhofer IIS

March 27, 2026

Designing the Future Today: AI-Driven Multi-Die Design

By Synopsys