Die-to-Die (D2D) Interconnect Chiplet

Die-to-Die (D2D) Interconnect Chiplet enable high-bandwidth, low-latency communication between dies within a package. They are essential for scalable chiplet-based architectures that rely on fast and efficient on-package data movement.

D2D chiplets support standards such as UCIe and proprietary interfaces, enabling multi-vendor interoperability and modular system design.