Modeling, Optimizing and Exploring Multi-Die FPGA Routing Architectures By Amirhossein Poolad, University of Toronto June 5, 2026
A 32 Gb/s 0.41 pJ/bit Single-Ended Transmitter with TX-Based-Only Adaptive Crosstalk Cancellation for Ultra-Short-Reach Wireline Applications By Yixuan Shen, Institute of Microelectronics of the Chinese Academy of Sciences June 5, 2026
Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack By Mohammad Elahi, Rensselaer Polytechnic Institute June 2, 2026
Dispersion-Engineered Terahertz Silicon Interconnects Enabling Terabit-Scale Data Links By Bodhan Chakraborty, Nanyang Technological University June 1, 2026
Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs By Ilias Exouzidis, National Technical University of Athens May 29, 2026
CLIPGen: A Chiplet Link IP Modeling and Generation Framework for 2.5D Architecture Exploration By Zhengping Zhu, New York University May 28, 2026
Wafer Warpage of Silicon Interposer in Manufacturing Processes for High Density 2.5D Advanced Packaging: Causes, Measurement, Analysis and Optimization By Hanwen Cui, Wuhan University May 22, 2026
Predictive Software Scheduling as an Early-Warning Hint Layer for Optical Engine Thermal Drift in Heterogeneous SoIC Packaging By Chi Fei Chung, Dollarchip Technology Inc. May 19, 2026
Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook By Ye Chen, Ghent University, IMEC May 18, 2026
CCD-Level and Load-Aware Thread Orchestration for In-Memory Vector ANNS on Multi-Core CPUs By Yuchen Huang, East China Normal University May 15, 2026
A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs By Baibhari Priya Barua, University of Tennessee May 13, 2026
Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems By Giorgio Di Natale, Univ. Grenoble Alpes May 12, 2026
AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving By Zhongkai Yu, University of California April 30, 2026
Exploring the Efficiency of 3D-Stacked AI Chip Architecture for LLM Inference with Voxel By Yiqi Liu, University of Illinois Urbana-Champaign April 30, 2026
Epoxy Composites Reinforced with Long Al₂O₃ Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging By Zihao Lin, Georgia Institute of Technology April 29, 2026
Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures By Peter Wegmann, Technical University of Munich April 29, 2026
Cross Waveguide Design for Color-Centers in Diamond for Photonic Quantum Computing By Alessio Miranda, Delft University of Technology April 27, 2026
CHICO-Agent: An LLM Agent for the Cross-layer Optimization of 2.5D and 3D Chiplet-based Systems By Qihang Wu, Arizona State University April 22, 2026
A PPA-Driven 3D-IC Partitioning Selection Framework with Surrogate Models By Shang Wang, University of Alberta April 22, 2026