CHICO-Agent: An LLM Agent for the Cross-layer Optimization of 2.5D and 3D Chiplet-based Systems
April 22, 2026
Chiplet Technical Papers
A PPA-Driven 3D-IC Partitioning Selection Framework with Surrogate Models
April 22, 2026
Fleet: Hierarchical Task-based Abstraction for Megakernels on Multi-Die GPUs
April 21, 2026
ChipLight: Cross-Layer Optimization of Chiplet Design with Optical Interconnects for LLM Training
April 20, 2026
ELMoE-3D: Leveraging Intrinsic Elasticity of MoE for Hybrid-Bonding-Enabled Self-Speculative Decoding in On-Premises Serving
April 17, 2026
Technology solutions targeting the performance of gen-AI inference in resource constrained platforms
April 15, 2026
Rethinking Compute Substrates for 3D-Stacked Near-Memory LLMDecoding: Microarchitecture–Scheduling Co-Design
April 8, 2026
DeepStack: Scalable and Accurate Design Space Exploration for Distributed 3D-Stacked AI Accelerators
April 7, 2026
Mapping Space Exploration for Multi-Chiplet Accelerators Targeting LLM Inference Serving Workloads
April 3, 2026
Escaping Flatland: A Placement Flow for Enabling 3D FPGAs
April 2, 2026
3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment
April 1, 2026
Expert Streaming: Accelerating Low-Batch MoE Inference via Multi-chiplet Architecture and Dynamic Expert Trajectory Scheduling
March 31, 2026
WarPGNN: A Parametric Thermal Warpage Analysis Framework with Physics-aware Graph Neural Network
March 26, 2026
DUET: Disaggregated Hybrid Mamba-Transformer LLMs with Prefill and Decode-Specific Packages
March 25, 2026
DS2SC-Agent: A Multi-Agent Automated Pipeline for Rapid Chiplet Model Generation
March 25, 2026
In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Directions
March 24, 2026
ODIN-Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation
March 23, 2026
Chipmunq: Fault-Tolerant Compiler for Chiplet Quantum Architectures
March 18, 2026
LEXI: Lossless Exponent Coding for Efficient Inter-Chiplet Communication in Hybrid LLMs
March 17, 2026
Link Quality Aware Pathfinding for Chiplet Interconnects
March 13, 2026