Divide and conquer: Scalable performance and energy in MCM GPUs
October 5, 2026
Chiplet Technical Papers
A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling
October 5, 2026
QBX: A Compiler for 2-local Qubit Hamiltonian Simulation on Quantum Chiplets
September 29, 2026
U-Can-Inject-Errors (UCIe): A Protocol-Aware Hardware Trojan for FPGA Chiplet Links
September 28, 2026
The Power of Indirection: Scaling Switches Beyond Silicon Boundaries
September 28, 2026
Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration
September 22, 2026
Cu-Cu Hybrid Bonding for Chiplets Heterogeneous Integration
September 21, 2026
Location-Aware Caching Mechanism for minimizing performance degradation induced by inefficient inter-chiplet data path
September 17, 2026
Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging
September 15, 2026
A Unified Interconnection Network for Chiplet-Based Scaling of the BrainScaleS Neuromorphic System
September 15, 2026
Fengshui: Demystifying Chiplet Ecosystem and Bespoke Neural Network Accelerator Codesign
September 11, 2026
Hardware Trojan Threats to Multi-Chiplet Photonic Neural Network Accelerators
September 9, 2026
Mapping Dynamic, Hierarchical Quantum Circuits
September 9, 2026
Chiplet-Based Techniques for Scalable and Memory-Aware Multiscalar Multiplication on Hardware Platforms
September 7, 2026
A Time-Encoded Analog Photonic Interposer for Energy-Efficient Integration of Analog Vision Sensors and Analog Accelerators
September 7, 2026
Self-Activated Direct Bonding with a Highly Polar Atomic-Layer-Deposited Film for 3D Integration
September 4, 2026
FLINT: Efficiently Leveraging High Bandwidth Flash for Capacity-Scalable LLM Inference Acceleration
September 2, 2026
Beacon: LLM Multi-Agent Driven Hardware Design Space Exploration for Heterogeneous Multi-Chiplet Deep Learning Accelerators
September 1, 2026
CHIPSMORE: Compute-in-Interconnect and -Memory Chiplets for Multi-Mode Multi-Request LLM Inference Acceleration
September 1, 2026
ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI
August 31, 2026
