Chiplet Ecosystem Insights

Ecosystem Highlights

Expert Perspectives

Recent Updates

Tenstorrent Releases Open Source Beta of the Open Chiplet Atlas® (OCA) Harness

2026-10-23 05:08:46

Standards & Research

Building Out Advanced Packaging Portfolio, JCET Delivers Steady Revenue Growth and Improved Profitability in Q3 YTD 2026

2026-10-22 13:42:18

Manufacturing & Supply Chain

Egis Group and SiPearl Sign Strategic Cooperation and Investment Agreements to Expand Opportunities on a Global Scale

2026-10-22 11:47:00

Ecosystem & Strategy

Unigen Expands AI Module and Server Compute Collaboration to EdgeCortix RAIDEN Platform

2026-10-22 06:50:38

Ecosystem & Strategy

Amkor Technology and NVIDIA Advance Strategic Partnership for AI Infrastructure

2026-10-21 12:13:09

Business & Deals

Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA

2026-10-21 11:57:00

Design, Tools & Validation

Photon Bridge Raises €10M to Tackle AI’s Emerging Laser Bottleneck

2026-10-21 11:17:00

Business & Deals

Abacus Semiconductor and Aalto University Announce Research Cooperation on High-Speed Chiplet Interconnects

2026-10-21 06:09:55

Standards & Research

UK Launches Semiconductor Catapult to Strengthen Sovereign Capabilities in AI Hardware and Defence

2026-10-20 15:25:43

Ecosystem & Strategy

Accelerating Development of Mass-Production Technologies for Photonics-Electronics Convergence Devices to Support Next-Generation AI Computing

2026-10-20 07:45:42

Standards & Research

BOS Semiconductors Partners with LG Electronics and HANA Micron to Advance Domestic Development of Chiplet-Based Automotive Semiconductors

2026-10-20 06:36:00

Ecosystem & Strategy

Innolux's Deployment of Key FOPLP Technologies: Leading Next-Gen Advanced Packaging and Seizing AI Opportunities

2026-10-16 07:25:11

Manufacturing & Supply Chain

Wiwynn, Ayar Labs, and GUC Advance Co-Packaged Optics with Live Demonstration of Integrated Optical Compute System at OCP Global Summit 2026

2026-10-14 11:33:33

Interconnects & Integration

ForwardEdge ASIC Announces UCIe 3.0 IP Solution to Accelerate Next-Generation Chiplet-Based ASIC Innovation

2026-10-14 06:29:41

Chiplet-Ready IP

Eliyan Introduces NuLight™: World’s First 2D microVCSEL Interconnect Solution to the Copper Wall

2026-10-14 05:45:00

Chiplets

Evatec delivers first CLUSTERLINE® 310 for Advanced Packaging on small panel formats

2026-10-13 15:26:45

Manufacturing & Supply Chain

Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle

2026-10-13 11:21:07

Manufacturing & Supply Chain

ZEISS strengthens advanced packaging portfolio with solutions for inline X-ray inspection and wafer warpage correction

2026-10-13 08:17:42

Design, Tools & Validation

Microsoft to expand Azure Maia system to multi-gigawatt deployments

2026-10-13 06:54:45

Chiplet-Based Chips

Chiplets at the Edge: How Modular SoCs Redefine Performance Per Watt

2026-10-08 18:43:00

Analysis & Commentary