Silicon Box Ships 1 Billion Units, 2 Billion Year-End Production Target
2026-10-02 09:42:11
Chiplet Ecosystem Insights
Ecosystem Highlights
SignatureIP Unveils IP Library for Chiplet-based AI, HPC and Data Center Systems
2026-10-01 06:26:10
AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers
2026-09-30 11:22:31
Racyics UCIe PHY IP for GlobalFoundries 22FDX reaches silicon
2026-09-28 09:57:02
Expert Perspectives
UALink over UCIe 3.0: Maximizing Performance for Chiplet-based Designs
October 2, 2026
Physical AI Doesn't Just Scale Up. It Scales Out.
October 2, 2026
Ayar Labs and GUC Complete Successful Thermal Co-Simulation Testing of Co-Packaged Optics
October 2, 2026
Overcoming Cleaning and Plating Challenges in Panel-Level Packaging and Manufacturing
October 1, 2026
Recent Updates
Global Electronics Association and Fraunhofer Group for Microelectronics Sign MoU to Support Advanced Packaging Industrial Adoption
2026-10-05 07:32:37
Standards & Research
Silicon Box Ships 1 Billion Units, 2 Billion Year-End Production Target
2026-10-02 09:42:11
Manufacturing & Supply Chain
Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling
2026-10-01 15:12:53
Ecosystem & Strategy
ficonTEC & HTSI Announce Strategic Cooperation to Scale Advanced CPO Test Solutions in Taiwan
2026-10-01 14:59:00
Design, Tools & Validation
SignatureIP Unveils IP Library for Chiplet-based AI, HPC and Data Center Systems
2026-10-01 06:26:10
Chiplet-Ready IP
AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers
2026-09-30 11:22:31
Analysis & Commentary
Hamamatsu Photonics develops inverted emission microscope "iPHEMOS®-DDX" for failure analysis of advanced semiconductor packages
2026-09-30 07:05:20
Design, Tools & Validation
EV Group Highlights Hybrid Bonding, Layer Transfer and Lithography Technologies for Heterogeneous Integration and Device Scaling at SEMICON West 2026
2026-09-29 13:23:51
Manufacturing & Supply Chain
ERS electronic Unveils Fully Automated 310 x 310mm Panel-Level Packaging System to Power AI and Chiplet Architectures
2026-09-29 06:49:58
Manufacturing & Supply Chain
Racyics UCIe PHY IP for GlobalFoundries 22FDX reaches silicon
2026-09-28 09:57:02
Chiplet-Ready IP
EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet Platform Purpose-Built for Physical AI
2026-09-24 05:26:00
Chiplet-Based Chips
Coherent Launches PhotonLink™ Integrated Optics Platform for AI Infrastructure
2026-09-23 11:32:02
Interconnects & Integration
AT&S and Marvell Technology expand collaboration to support next-generation AI infrastructure
2026-09-22 08:03:36
Manufacturing & Supply Chain
SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products
2026-09-21 13:29:00
Interconnects & Integration
OpenLight Adds Former GlobalFoundries Silicon Photonics Leader Kevin Soukup and Semiconductor Veteran Kirk Ouellette to Executive Team
2026-09-21 06:16:09
Misc
Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026
2026-09-21 05:54:11
Interconnects & Integration
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028
2026-09-18 11:20:30
Analysis & Commentary
onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era
2026-09-17 15:25:00
Interconnects & Integration
GlobalFoundries and Marvell expand collaboration for next-generation optical connectivity
2026-09-17 13:17:00
Business & Deals
NewPhotonics® and Tower Semiconductor Begin High-Volume Shipments of Laser-Integrated, Serviceable Optical Engine PICs for Scale-Out and Scale Up AI Interconnect
2026-09-17 11:19:54
Manufacturing & Supply Chain