Chiplet-Based FPGAs Optimize Performance for Space Applications
2026-09-10 18:44:00
Chiplet Ecosystem Insights
Ecosystem Highlights
Expert Perspectives
Beyond the Die Boundary: How Arteris Multi-Die Technology Is Redefining AI System Design
September 10, 2026
Riding the Tide Toward Open Ecosystem-Based Chiplet Integration―Hitachi’s Efforts to Overcome Industry-wide Challenges with Quality Improvement Technology
September 7, 2026
3D IC design for the AI era: an EDA perspective
September 7, 2026
When the Package Becomes an Electrical Design Variable
September 4, 2026
Recent Updates
Fujitsu launches made-in-Japan next-generation CPU FUJITSU-MONAKA and Fujitsu MONAKA Server for sovereign AI infrastructure
2026-09-15 06:47:22
Chiplet-Based Chips
Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem
2026-09-15 06:17:41
Ecosystem & Strategy
Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP
2026-09-14 18:38:24
Design, Tools & Validation
Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026
2026-09-14 14:46:48
Misc
NcodiN Appoints Carlo Guareschi as Chief Business Officer, Yacine Halioua as Chief Product Officer, and Zachary Cho as General Manager, France
2026-09-14 11:23:00
Misc
Chiplet-Based FPGAs Optimize Performance for Space Applications
2026-09-10 18:44:00
Analysis & Commentary
Ayar Labs Expands 2026 Funding to $650 Million to Scale Manufacturing-Ready CPO for AI Scale-Up Beyond the Rack
2026-09-10 13:24:10
Business & Deals
From pilot line to industrial implementation: FIRST by FMD brings together decision-makers for Europe’s semiconductor future
2026-09-10 11:33:00
Ecosystem & Strategy
Amkor Technology Announces Phase 2 of Arizona Advanced Packaging and Test Campus; Expands Investment to $12 Billion
2026-09-09 05:47:11
Manufacturing & Supply Chain
HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem
2026-09-08 14:42:05
Business & Deals
EdgeCortix Signs Multi-Year, Multimillion-Dollar Agreement with Kawasaki Heavy Industries to Advance Next-Generation AI-Enabled Aerial Defense Systems
2026-09-08 07:40:00
Business & Deals
Crealights and GlobalFoundries Deepen Global Strategic Partnership
2026-09-08 07:24:16
Ecosystem & Strategy
Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects
2026-09-07 11:34:00
Standards & Research
Mercedes Spinout Athos Closes Its Doors
2026-09-02 18:54:00
Analysis & Commentary
NcodiN Appoints Semiconductor Industry Veteran Kiran Burli as Chief Operations Officer
2026-09-02 05:50:14
Misc
EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics
2026-09-01 13:17:00
Interconnects & Integration
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI”
2026-09-01 08:14:04
Manufacturing & Supply Chain
Credo Joins Open CPX MSA Organization
2026-09-01 05:47:13
Standards & Research
Qnity Introduces Stackplane™ CMP Slurry Platform for Advanced Packaging
2026-08-31 11:24:44
Manufacturing & Supply Chain
Quintessent Raises $40 Million Series A and Begins Sampling First Product for AI Optical Interconnects
2026-08-28 08:48:05
Interconnects & Integration