NoCs and the transition to multi-die systems using chiplets
August 2, 2024
Chiplet Technical Papers
Architecture-stage EDA Tool VisualSim to Design UCIe-based Multi-die SoC
July 29, 2024
Towards efficient ESD protection strategies for advanced 3D systems-on-chip
July 29, 2024
Hecaton: Training and Finetuning Large Language Models with Scalable Chiplet Systems
July 10, 2024
Occamy: A 432-Core 28.1 DP-GFLOP/s/W 83% FPU Utilization Dual-Chiplet, Dual-HBM2E RISC-V-based Accelerator for Stencil and Sparse Linear Algebra Computations with 8-to-64-bit Floating-Point Support in 12nm FinFET
June 25, 2024
Chiplet-Gym: Optimizing Chiplet-based AI Accelerator Design with Reinforcement Learning
June 19, 2024
Probeless Fault Isolation Capability for 2.5D/3D Chiplet Die-to-Die Interconnect
June 18, 2024
Chiplets on Wheels : Review Paper on holistic chiplet solutions for autonomous vehicles
June 5, 2024
Modeling and Controlling Many-Core HPC Processors: an Alternative to PID and Moving Average Algorithms
June 3, 2024
Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques
May 28, 2024
Chiplet Cloud: Building AI Supercomputers for Serving Large Generative Language Models
May 23, 2024
SCAR: Scheduling Multi-Model AI Workloads on Heterogeneous Multi-Chiplet Module Accelerators
May 6, 2024
Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
May 2, 2024
Towards Scalable Multi-Chip Wireless Networks with Near-Field Time Reversal
May 2, 2024
SPIRAL: Signal-Power Integrity Co-Analysis for High-Speed Inter-Chiplet Serial Links Validation
May 1, 2024
Muchisim: A Simulation Framework for Design Exploration of Multi-Chip Manycore Systems
April 29, 2024
The 3D-IC Multiphysics Challenge Dictates A Shift-Left Strategy
April 26, 2024
UMI Scales the Memory Wall in the Chiplet/Multi-Die Era
April 24, 2024
The Revolution of Chiplet Technology in Automotive Electronics and Its Impact on the Supply Chain
April 18, 2024
Five Workflows for Tackling Heterogeneous Integration of Chiplets for 2.5D/3D
April 17, 2024
