Advanced Packaging
Advanced Packaging refers to a set of next-generation semiconductor packaging technologies designed to improve chip performance, power efficiency, and integration beyond what traditional packaging can achieve. Instead of simply connecting a single chip to a motherboard, advanced packaging brings multiple chips or chiplets together in highly optimized ways, enabling faster communication, smaller form factors, and dramatically better performance.
In simple terms, Advanced Packaging is the “glue” and “architecture” that make modern multi-chip and chiplet-based systems possible.
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