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12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver

UCIe based Ka/Ku band transceiver
Wide Bandwidth
Scalable solution for dense mm-wave radio into single multi-chip modules

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Interconnect Chiplet

Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard
Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard

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Direct Chiplet Interface

This device will enable CrossFire customers that have integrated DCI connectivity into their Chiplets to connect to Chiplets equipped with the standard high power, low density UCIe interface.

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HBM3e Advanced-packaging chiplet for all workloads

Scalable AI, fortified with high compute density and ample memory bandwidth

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High-Density Electronic-Photonic Chiplet

Parallel electrical interface
Supports AIB and other proprietary parallel interfaces
8 full-duplex optical ports

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UCIe AP based 8-bit 170-Gsps Chiplet Transceiver

2T2R chiplet configuration
160/175-GSa/s sample rate
7-bit resolution

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UCIe based 8-bit 48-Gsps Transceiver

48-Gsps peak sample rate
8 bit resolution
UCIe SP (16x lanes at 16Gbps) with streaming controller

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UCIe based 12-bit 12-Gsps Transceiver

12-Gsps peak sample rate
12 bit resolution (programmable)
UCIe SP (16x lanes at 16Gbps) with streaming controller

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PCIe Gen 5 Chiplet

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Active silicon interposer

Network-On-Interposer
4 Tbps aggregate bisection bandwidth

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Quad Core RISC-V with AI Chiplet

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100G optical I/O chiplets

RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications

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