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New Chiplets

Direct Chiplet Interface

This device will enable CrossFire customers that have integrated DCI connectivity into their Chiplets to connect to Chiplets equipped with the standard high power, low density UCIe interface.

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HBM3e Advanced-packaging chiplet for all workloads

Scalable AI, fortified with high compute density and ample memory bandwidth

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High-Density Electronic-Photonic Chiplet

Parallel electrical interface
Supports AIB and other proprietary parallel interfaces
8 full-duplex optical ports

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UCIe AP based 8-bit 170-Gsps Chiplet Transceiver

2T2R chiplet configuration
160/175-GSa/s sample rate
7-bit resolution

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UCIe based 8-bit 48-Gsps Transceiver

48-Gsps peak sample rate
8 bit resolution
UCIe SP (16x lanes at 16Gbps) with streaming controller

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UCIe based 12-bit 12-Gsps Transceiver

12-Gsps peak sample rate
12 bit resolution (programmable)
UCIe SP (16x lanes at 16Gbps) with streaming controller

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PCIe Gen 5 Chiplet

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Parallel Single Mode (PSM) 16-channel 112 Gbps Transmitter Chiplet

16x DR4 specification compliant transmit channels including modulator and driver
Digital SPI control interface

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Active silicon interposer

Network-On-Interposer
4 Tbps aggregate bisection bandwidth

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Quad Core RISC-V with AI Chiplet

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100G optical I/O chiplets

RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications

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Memory Chiplet

Stealth Mode Products design to disrupt AI/Generative AI processing.

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