3D-IC
3D-IC (Three-Dimensional Integrated Circuit) is an advanced semiconductor packaging technology that stacks multiple chips—often called dies—directly on top of one another to create a single, tightly integrated system. Instead of placing chips side-by-side, as in 2.5D integration, 3DIC connects them vertically using ultra-dense interconnects such as TSVs (Through-Silicon Vias) or Hybrid Bonding.
In simple terms, 3D-IC is like building a “skyscraper of chips,” allowing data to move faster and using less power than traditional flat chip designs.
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