3D Guard-Layer: An Integrated Agentic AI Safety System for Edge Artificial Intelligence By Eren Kurshan, Princeton University November 14, 2025
PICNIC: Silicon Photonic Interconnected Chiplets with Computational Network and In-memory Computing for LLM Inference Acceleration By Yue Jiet Chong, National University of Singapore November 7, 2025
Optimizing Attention on GPUs by Exploiting GPU Architectural NUMA Effects By Mansi Choudhary, Duke University November 6, 2025
Inter-chip Clock Network Synthesis on Passive Interposer of 2.5D Chiplet Considering Transmission Line Effect By Tai Yan, Beihang University November 5, 2025
Simulation-Driven Evaluation of Chiplet-Based Architectures Using VisualSim By Wajid Ali, University of Engineering and Technology November 4, 2025
CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems By Lukas Pfromm, University of Wisconsin–Madison October 31, 2025
Taming the Tail: NoI Topology Synthesis for Mixed DL Workloads on Chiplet-Based Accelerators By Arnav Shukla, Indraprastha Institute of Information Technology October 30, 2025
Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs By Junhyeok Park, Electronics and Telecommunications Research Institute October 29, 2025
Towards Future Microsystems: Dynamic Validation and Simulation in Chiplet Architectures By Shailesh Chouhan, Luleå University of Technology October 29, 2025
Self-Attention to Operator Learning-based 3D-IC Thermal Simulation By Zhen Huang, University of Science and Technology of China October 29, 2025
DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design By Xinling Yu, University of California October 23, 2025
LEGOSim: A Unified Parallel Simulation Framework for Multi-chiplet Heterogeneous Integration By Tiantian Lin, Zhejiang University October 21, 2025
3D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency By Janak Sharda, Georgia Institute of Technology October 20, 2025
Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects By Francesco Villasmunta, Technical University of Applied Sciences Wildau October 13, 2025
Mozart: A Chiplet Ecosystem-Accelerator Codesign Framework for Composable Bespoke Application Specific Integrated Circuits By Haoran Jin, University of Michigan October 13, 2025
On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach By Debendra Das Sharma, Intel October 9, 2025
3D Electronic-Photonic Heterogenous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures For Future HPC Systems By Anirban Samanta, University of California October 9, 2025
Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package By Pascal Stadler, Institute of Integrated Systems October 6, 2025