Dispersion-Engineered Terahertz Silicon Interconnects Enabling Terabit-Scale Data Links
June 1, 2026
Chiplet Technical Papers Archive - Page 2 of 15
Design-Oriented Modeling of TSV Substrate Noise Coupling to Ring VCOs
May 29, 2026
CLIPGen: A Chiplet Link IP Modeling and Generation Framework for 2.5D Architecture Exploration
May 28, 2026
Wafer Warpage of Silicon Interposer in Manufacturing Processes for High Density 2.5D Advanced Packaging: Causes, Measurement, Analysis and Optimization
May 22, 2026
Predictive Software Scheduling as an Early-Warning Hint Layer for Optical Engine Thermal Drift in Heterogeneous SoIC Packaging
May 19, 2026
Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook
May 18, 2026
CCD-Level and Load-Aware Thread Orchestration for In-Memory Vector ANNS on Multi-Core CPUs
May 15, 2026
A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs
May 13, 2026
Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems
May 12, 2026
Affinity Tailor: Dynamic Locality-Aware Scheduling at Scale
May 4, 2026
AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving
April 30, 2026
Exploring the Efficiency of 3D-Stacked AI Chip Architecture for LLM Inference with Voxel
April 30, 2026
Epoxy Composites Reinforced with Long Al₂O₃ Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging
April 29, 2026
Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures
April 29, 2026
Cross Waveguide Design for Color-Centers in Diamond for Photonic Quantum Computing
April 27, 2026
CHICO-Agent: An LLM Agent for the Cross-layer Optimization of 2.5D and 3D Chiplet-based Systems
April 22, 2026
A PPA-Driven 3D-IC Partitioning Selection Framework with Surrogate Models
April 22, 2026
Fleet: Hierarchical Task-based Abstraction for Megakernels on Multi-Die GPUs
April 21, 2026
ChipLight: Cross-Layer Optimization of Chiplet Design with Optical Interconnects for LLM Training
April 20, 2026
ELMoE-3D: Leveraging Intrinsic Elasticity of MoE for Hybrid-Bonding-Enabled Self-Speculative Decoding in On-Premises Serving
April 17, 2026
