Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration

By Himanandhan Reddy Kottur ¹, Nusra Akter Takia ¹, Mahamudul Hassan Fuad ¹, Istiaq Firoz Shiam ¹, Matthew Walsh ², Navid Asadizanjani ^1
1 Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL, USA
² Florida Semiconductor Engine, Kissimmee, FL, USA

Abstract

Failure analysis is being reshaped by heterogeneous integration, chiplet-based architectures, hybrid bonding, backside technologies, & increasingly buried package structures. To examine how practitioners view this transition, an anonymous survey was distributed across a broad set of organizations involved in semiconductor design, packaging, systems, tools, & failure analysis. The survey collected approximately one hundred responses & probed organizational background, supported product domains, future priorities in failure analysis, critical bottlenecks, sample preparation challenges, emerging architecture specific pain points, & perceived needs for workflow acceleration & data standardization. The results show that heterogeneous integration, chiplet, and three-dimensional products dominate the respondent base at 69%, while package & heterogeneous integration failure analysis received the highest importance rating at 7.92 out of 10. Hybrid bonding emerged as the most difficult new architecture to analyze at 54%, higher-resolution non-destructive imaging ranked as the most important future accelerator at 8.18 out of 10, and 83% of respondents supported formalized data standardization frameworks. The complete survey data are provided in Appendix A (Table II) to improve transparency & support future benchmarking.

Keywords — failure analysis, heterogeneous integration, advanced packaging, hybrid bonding, chiplets, non-destructive imaging, sample preparation, standardization, artificial intelligence.

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