HBM3e Advanced-packaging chiplet for all workloads

GenAI for All, Maximum Impact at Minimal Cost

Designed to power large-scale AI systems, REBEL achieves the highest level of energy efficiency while delivering top performance. Equipped with the latest HBM3E, REBEL demonstrates outstanding computing speed and throughput per Watt, making state-of-the-art AI services more accessible. REBEL gives companies the extra edge to stay ahead of the competition.

GenAI for All, Maximum Impact at Minimal Cost

Designed to power large-scale AI systems, REBEL achieves the highest level of energy efficiency while delivering top performance. Equipped with the latest HBM3E, REBEL demonstrates outstanding computing speed and throughput per Watt, making state-of-the-art AI services more accessible. REBEL gives companies the extra edge to stay ahead of the competition.

Performance at Any Scale: from a Single Card to a GenAI Datacenter

Combine four dies onto a single IC chip, connected through the state-of-the- art advanced chiplet packaging. Scale beyond a single card to multi-rack configurations, able to support any multi-modal models for years to come. Achieve greater sustainability of accelerating AI workloads for the upcoming power-hungry GenAI datacenters.