Link Quality Aware Pathfinding for Chiplet Interconnects
By Aaron Yen, Jooyeon Jeong, Puneet Gupta
University of California, Los Angeles, USA

Abstract
As chiplet-based integration advances, designers must select among short-reach die-to-die interconnect technologies with widely varying shoreline and areal bandwidth density, energy per bit, reach, and raw bit error rate (BER). Meeting stringent delivered BER targets in chiplet systems requires error-correcting codes (ECC), but incurs energy, area, and throughput overheads. We develop a flow centered around RTL synthesis power and area estimations to support pathfinding of inter-chiplet links under a stringent 10-27 delivered BER target. We synthesize a parameterized Reed-Solomon code with CRC-64 and Go-Back-N retry logic to estimate the correction overhead for different transceiver bit error rates. Results show that ECC can materially change link comparisons under common figures of merit and that CRC+ARQ can reduce the required RS strength (and decoder overhead) at moderate BERs while still meeting stringent delivered-BER targets. We present a CP-SAT-based link assignment formulation that uses these ECC-corrected metrics under reach, delivered-bandwidth, and shoreline constraints in system-level optimization.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Technical Papers
- Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging
- Fault Modeling, Testing, and Repair for Chiplet Interconnects
- Optimizing Inter-chip Coupler Link Placement for Modular and Chiplet Quantum Systems
- ChipLight: Cross-Layer Optimization of Chiplet Design with Optical Interconnects for LLM Training
Latest Technical Papers
- Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration
- 2.5D Root of Trust: Securing the Chiplet Ecosystem
- Plasma Etch Process Optimization for Photonic-Grade Diamond-on-Insulator Substrates and Thickness Evaluation using Colorimetry
- CUTh-Solver: GPU-Accelerated Sparse Matrix Solver for High-Resolution Thermal Simulation of 3D ICs
- Making Locality-aware GEMM Compatible with Page-Granularity Placement on Chiplet GPUs