Arm Positions Neoverse for AI and Telco Networks at MWC
Strategic focus on custom silicon allows operators to manage 5G costs while preparing for 6G and the AI-driven data surge.
By Pablo Valerio, EE Times | March 11, 2026
BARCELONA, Spain — At the 2026 Mobile World Congress (MWC), Arm showed its technology as the telecommunications sector faces a dual mandate: managing the capital expenditures of existing 5G networks while preparing for the AI workloads that will define the upcoming 6G standard.
Arm presented its computing architecture as foundational for this transition, prioritizing power efficiency in both data centers and network edges. In an interview with EETimes at the show, Eddie Ramírez, VP of Arm’s infrastructure business, detailed the company’s strategy to support providers as they integrate AI into networks.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- AMI Introduces New Management Platform Arm Neoverse CSS Chiplet
- Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
- Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design
- Kalray and Arm to collaborate to bring data intensive processing and AI acceleration DPU solutions to the global Arm ecosystem
Latest News
- Staera Semiconductor Emerges from Stealth with US$4.6 Million to Build Light into the Chip and Break AI's Data Bottleneck
- Vertical Compute expands partnership with imec to accelerate commercial manufacturing of Vertically Integrated Memory (VIM)
- Imec advances Europe's silicon interposer technology capabilities through NanoIC pilot line, paving the way for open chiplet design
- SCHMID Group Secures Key Wet-Process Equipment Order for South Asia’s First Glass Core Substrate Manufacturing Facility
- EV Group Helps Accelerate Qubit Scaling for Quantum Computing Through Advanced Packaging Expertise