The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk
Advanced packaging has emerged as a critical enabler of next-generation applications for artificial intelligence (AI), high-performance computing, wearables, 6G communication, and defense technologies. As traditional scaling approaches face increasing limitations, Advanced packaging enables further miniaturization and improved performance through heterogeneous integration, chip stacking, and high-density interconnects.
In Europe, advanced packaging has emerged as a strategic focus in the region’s ambition to build a resilient and self-sufficient semiconductor ecosystem. With significant investments under initiatives such as the European Chips Act, the goal is to drive semiconductor innovation, focusing on R&D, packaging and manufacturing to enhance Europe’s technological sovereignty and supply chain resilience.
Following the grand opening ceremony of our facility and Advanced Packaging Competence Centre in Barbing, Germany, we hosted a webinar on February 25th as a chance for an international audience to gain insights into the latest developments in advanced packaging in Europe.D
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Blogs
- Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology
- Advanced Packaging Evolution: Chiplet and Silicon Photonics-CPO
- Extending Moore’s Law via high-end packaging and advanced IC substrates
- TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
Latest Blogs
- The Bottleneck Isn’t Compute. It’s Getting the Chip Built!
- How Intel Foundry Packaging Technologies Redefine AI and HPC Scalability Limits at ECTC 2026
- From complexity to simplicity: Scaling and future-proofing chiplets with AMBA®︎ CHI C2C property negotiation
- High-Speed Heterogeneous Integration with Multiphysics Analysis for TSMC SoW-X
- Chiplet Realization Beyond the Package: Why the Next AI Bottleneck Moves to the Interposer-to-PCB Boundary