Advanced Packaging & Chiplet Design with Chipletz

In this episode of the Altium OnTrack Podcast, host Zach Peterson sits down with Stephen Newberry, Victor Kronberg, and Ching-Ping Wong from Chipletz — a fabless advanced packaging company pushing the boundaries of die-to-die interconnect technology. The team shares their background, their work on chiplet-based package design, and the technical paper they presented at DesignCon, which introduces the wallstrip transmission line: a novel interconnect structure designed to improve insertion loss, manage crosstalk, and enable higher data rates in chiplet packages without the need for a silicon interposer.

The conversation dives deep into the signal integrity challenges of advanced packaging, including how the wallstrip structure compares to traditional microstrip and stripline configurations, the role of the UCIE standard in enabling chiplet interoperability, and the long-term potential for an open chiplet marketplace. Whether you're a PCB designer curious about making the leap into IC packaging or an SI/PI engineer tracking the cutting edge of high-bandwidth interconnect design, this episode offers rare, expert-level insight into one of the most exciting frontiers in electronics engineering.