Semiconductors supply chain ecosystem for advanced packaging
IEEE Electronics Packaging Society, Silicon Valley Chapter, USA, organized a seminar on semiconductors supply chain ecosystem for advanced packaging.
Luu Nguyen, Program Director, PSiQuantum, introduced the speaker,. Kitty Pearsall. There will be several symposia in 2025, including hybrid bonding, HIR, build-up substrate, and reliability for electronics and photonics packaging, respectively.
Global semiconductor market growth
Dr. Kitty Pearsall. Consultant, Capstan Technologies, said the global semiconductor market was $532 billion in 2023, and increased to $611 billion in mid-year 2024. Semiconductor market anticipates 19 percent growth in 2024, ending with $630 billion. The global semiconductor market will increase to $716.7 billion in 2025, as per Gartner.
Design complexity is increasing the growth of AI/ML, forcing innovation in processes, and advanced simulation and verification tools. Revenue growth driven by AI/ML is see surge in demand. Automotive sector with e-vehicles is also driving semiconductor demand.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related Blogs
- Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology
- Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors
- Advanced Packaging Changes the Rules for Semiconductor Health and Performance Management
- Tackling Key HBM and Advanced Packaging Bottlenecks for the AI Era
Latest Blogs
- AI Memory Is More Than HBM: The Chiplet Era Is Forcing the Entire Memory Hierarchy to Scale
- The AI Packaging Challenge: 5 Reasons Panels Are Gaining Momentum
- Understanding the Shift Towards Chiplet Architecture in SoC Design
- Cooling Is Becoming Part of the Chiplet Architecture
- When AI Moves the World: Building a Chiplet Standard for Physical AI