Scope: A Scalable Merged Pipeline Framework for Multi-Chip-Module NN Accelerators
February 20, 2026
Chiplet Technical Papers
Scaling Routers with In-Package Optics and High-Bandwidth Memories
February 18, 2026
TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning
February 16, 2026
Towards Scalable Multi-Chip Wireless Networks with Near-Field Time Reversal
February 11, 2026
Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding
February 11, 2026
Toward Digital Twins in 3D IC Packaging: A Critical Review of Physics, Data, and Hybrid Architectures
February 4, 2026
Foundry-Enabled Patterning of Diamond Quantum Microchiplets for Scalable Quantum Photonics
February 3, 2026
Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
January 30, 2026
Lifecycle Cost-Effectiveness Modeling for Redundancy-Enhanced Multi-Chiplet Architectures
January 28, 2026
DISTIL: A Distributed Spiking Neural Network Accelerator on 2.5D Chiplet Systems
January 27, 2026
Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability
January 22, 2026
EOTPR Fine Pitch Probing for Die-to-Die Interconnect Failure Analysis
January 21, 2026
InterPUF: Distributed Authentication via Physically Unclonnable Functions and Multi-party Computation for Reconfigurable Interposers
January 20, 2026
Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging
January 19, 2026
The Road to 64G UCIe IP: What Designers Need to Know
January 14, 2026
Development and Optimization of Fine-Pitch RDL for RDL Interposer, and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology
January 13, 2026
Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
January 7, 2026
High-Efficient and Fast-Response Thermal Management by Heterogeneous Integration of Diamond on Interposer-Based 2.5D Chiplets
January 5, 2026
HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement
January 5, 2026
A physics-constrained and data-driven approach for thermal field inversion in chiplet-based packaging
December 30, 2025