RPU -- A Reasoning Processing Unit
By Matthew Joseph Adiletta, Gu-Yeon Wei and David Brooks
Harvard University

Abstract
Large language model (LLM) inference performance is increasingly bottlenecked by the memory wall. While GPUs continue to scale raw compute throughput, they struggle to deliver scalable performance for memory bandwidth bound workloads. This challenge is amplified by emerging reasoning LLM applications, where long output sequences, low arithmetic intensity, and tight latency constraints demand significantly higher memory bandwidth. As a result, system utilization drops and energy per inference rises, highlighting the need for an optimized system architecture for scalable memory bandwidth.
To address these challenges we present the Reasoning Processing Unit (RPU), a chiplet-based architecture designed to address the challenges of the modern memory wall. RPU introduces: (1) A Capacity-Optimized High-Bandwidth Memory (HBM-CO) that trades capacity for lower energy and cost; (2) a scalable chiplet architecture featuring a bandwidth-first power and area provisioning design; and (3) a decoupled microarchitecture that separates memory, compute, and communication pipelines to sustain high bandwidth utilization. Simulation results show that RPU performs up to 45.3x lower latency and 18.6x higher throughput over an H100 system at ISO-TDP on Llama3-405B.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Technical Papers
- Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving Perception
- Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects
- 3D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency
- LEGOSim: A Unified Parallel Simulation Framework for Multi-chiplet Heterogeneous Integration
Latest Technical Papers
- Making Locality-aware GEMM Compatible with Page-Granularity Placement on Chiplet GPUs
- Advanced semiconductor packaging design via artificial intelligence and machine learning: A review
- DTCO of NOR-Type IGZO FeFETs for 3D Heterogeneous AI Memories: A Read-Centric Perspective
- Modeling, Optimizing and Exploring Multi-Die FPGA Routing Architectures
- A 32 Gb/s 0.41 pJ/bit Single-Ended Transmitter with TX-Based-Only Adaptive Crosstalk Cancellation for Ultra-Short-Reach Wireline Applications