3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment

By Yasha Yi ^1,2 and Danny Wilkerson ^3 
1 Intelligent Optoelectronics Laboratory and Connected Systems Institute, University of Wisconsin, Milwaukee
² Microsystems Technology Laboratory, Massachusetts Institute of Technology, Cambridge​​​​​​​
³ Invictus Innovation EV Technology

Abstract

The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional photonic integration have emerged as promising solutions to overcome the energy and bandwidth limitations of electrical I/O. Yet, as optics move closer to compute, packaging, thermal management, and system-level robustness increasingly dominate performance and scalability. Here, we argue that co-packaged optics should not be viewed as a component-level optimization, but as an architectural commitment that reshapes the boundaries between photonics, electronics, and system design. We examine how heterogeneous integration strategies, chiplet-based optics, and emerging packaging platforms redefine scaling laws for AI systems, often introducing trade-offs that are underappreciated in device-centric analyses. Looking forward, we discuss why standardization, serviceability, and thermal-aware co-design will be decisive in determining whether co-packaged optics can transition from early deployment to widespread adoption in AI-scale datacenters.

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