Hybrid Bonding
Hybrid Bonding is an advanced semiconductor packaging technology that connects two chips—or layers of a chip—directly at both the metal and dielectric level. Unlike traditional solder-based connections, Hybrid Bonding creates ultra-dense, ultra-low-resistance bonds that allow chips to communicate faster, use less power, and fit into more compact designs.
In simple terms, Hybrid Bonding is like “gluing” chips together at the microscopic level with extreme precision, creating a nearly seamless electrical connection.
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