Thermal Simulator for Advanced Packaging and Chiplet-Based Systems
This talk introduces ARTSim 2.0, a compact thermal simulator supporting heterogeneous integration and advanced packaging. Learn how hybrid meshing, heterogeneous layer modeling, and parallel solvers are applied across case studies including 3D ICs, Intel EMIB, and TSMC InFO_PoP.
Speaker: Yousef Safari (Member, IEEE)
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