Standardizing System-Level Interoperability for Multi-Vendor Chiplets

Presenters:

• Gilberto Rodríguez, Vice President Business Development, Openchip
• Fady Dahoud, Director of SoC Platform, GSOC

Moving from monolithic SoCs to heterogeneous chiplets requires a unified system specification. For a multi-vendor marketplace to thrive- interoperability must extend beyond physical wires. We need a cohesive System-in-Package (SiP) specification that manages discrete dies as a single entity.This presentation introduces the OCP Chiplet System Group's framework for multi-vendor integration- focusing on:

•   Communication: Aligning PHY and Link layers for seamless data movement.
•   Management: Defining cross-die protocols for Boot-up- Power- Thermal- and Performance.
•   Security: Establishing a multi-vendor "Root of Trust" for attestation and firmware integrity.
•   Software Layer: A standardized stack to abstract hardware complexity for OS/hypervisor integration.

By defining these parameters- we provide a blueprint for a secure- performant chiplet ecosystem- giving architects the same confidence as with traditional monolithic designs.