The Evolution Of UCIe

Since it was released in March 2022, the Universal Chiplet Interconnect Express (UCIe) has grown from a basic way of connecting two dies together into a comprehensive specification that can ensure the handoff of data between various components in an advanced package, as well as validate the chiplets within that package. Mayank Bhatnagar, director of product marketing at Cadence, talks with Semiconductor Engineering about the physical elements in UCIe, the logical view of how it appears to design engineers, and how this can be customized for anything from a simple connection to a complex collection of chiplets that can come from multiple foundries and operate at different speeds.