Podcast - A Modular Future: Chiplets, AI, and Advanced Packaging
On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.
Next, Ken discusses how customer experience centers are driving innovation in complex embedded systems.
But first, Rich and Ken highlight some important industry news involving, you guessed it, AI. They’re also sharing some information ahead of embedded world 2025.
To watch the video, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Podcast: AI, Chiplets, and the Future of Semiconductors
- "Automotive AI: ADAS, Functional Safety and Chiplets" AI with Sally - New Tech Podcast
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- 3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
Latest Videos
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
- The State of Multi-Die: Insights and Customer Requirements
- Coding approaches for increasing reliability and energy efficiency of 3D technologies
- AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets