Podcast - A Modular Future: Chiplets, AI, and Advanced Packaging
On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.
Next, Ken discusses how customer experience centers are driving innovation in complex embedded systems.
But first, Rich and Ken highlight some important industry news involving, you guessed it, AI. They’re also sharing some information ahead of embedded world 2025.
To watch the video, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related Videos
- Podcast: AI, Chiplets, and the Future of Semiconductors
- Embedded World, Nuremberg: Arm’s Suraj Gajendra on AI, Chiplets, and the Future of Automotive Compute
- 3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
- Scaling Open Compute: RISC-V, Chiplets, and the Future of AI and Robotics
Latest Videos
- Accelerating Chiplet SoC Development with Standards-Based Frameworks and Automated Design Flows
- Qualcomm's Tony Pialis on Dragonfly and the Data Movement Wall
- From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands
- Advancing 3DIC Technologies to Propel AI Innovations
- Building Real Confidence in Chiplet Stacks with Evelyn Landman of proteanTecs