GENIOEVO™ – Architectural Exploration and Connectivity Management in Advanced Packaging

A Discussion of how GENIOEVO addresses Architectural Exploration and Connectivity Management in Advanced Packaging – With Daniel Nenni and Anna Fontanelli.

Advanced packaging is a set of techniques used in the semiconductor industry to combine multiple chips or components into a single package. It goes beyond traditional chip packaging by allowing for the integration of different types of devices, such as memory, processors, and sensors, into a single unit. This approach offers several benefits, including increased performance, reduced power consumption, and smaller form factors.  

In this complex three dimensional world, architectural exploration and connectivity management play crucial roles in achieving optimal performance, power efficiency, and cost-effectiveness.

Architectural exploration (partitioning, placement, technology selection, etc.) is the key factor for the system definition since this involves determining the optimal organization of different dies (chiplets) in the 3D stack.

Connectivity Management focuses on designing the intricate network of interconnects that link the chiplets together, leading to faster signal speeds, lower latency, reduced overall size and weight of electronic devices.

This video will highlight the key role GENIOEVO is playing in Advanced Packaging Architectural Exploration and Connectivity Management.