Propelling AI forward through Advanced Packaging Creativity

By Yin Chang, ASE, Inc.

The semiconductor industry is stacked with groundbreaking innovation that is helping to weave intelligence into every dimension of life, through generative, agentic and physical AI models, spanning all the way from the cloud to the edge. Data centers are at the center of it all, housing the infrastructure and networks that push performance boundaries and accelerate business results. But the challenges are real, particularly related to critical power and cooling demands. Heterogeneous Integration through advanced packaging is playing a pivotal role in pushing physical, electrical, and thermal limits to achieve better energy efficiency and greater compute power. During his keynote, Hung will set the stage by exploring the AI and data center landscape, highlighting challenges that require our collective attention, particularly as we move from electrons to photons. He will then expand on how advanced packaging creativity is propelling AI forward by integrating higher performance chips within smaller form factors for transformative latency improvement and bandwidth enhancement.