Onshoring Advanced Packaging in the United States

Dr. Charles Woychik, VP of Sales and Marketing, NHanced Semiconductor, Inc.

Presented at the IEEE Hybrid Bonding Symposium, January 2025, in Milpitas California

The semiconductor industry’s shift towards advanced packaging technologies, such as 2.5D, 3D integration, and heterogeneous integration, has underscored the critical need for onshoring these capabilities in the United States. Advanced packaging plays a pivotal role in enhancing chip performance, power efficiency, and form factor, bridging the gap as traditional transistor scaling approaches its physical limits. However, a significant portion of advanced packaging currently relies on overseas facilities, posing risks of supply chain vulnerabilities, IP leakage, and increased latency in innovation cycles.
This talk provides a technical analysis of the processes and materials involved in advanced packaging, including the critical importance of hybrid bonding, Through-Silicon Vias (TSVs), wafer-level packaging, and chiplet integration. It evaluates the current state of U.S. infrastructure and identifies gaps in lithography, substrate manufacturing, and bonding technologies. Furthermore, the study outlines the technological challenges of onshoring, such as thermal management, interconnect density, and material compatibility, and proposes solutions through advancements in design automation, precision manufacturing, and materials science.

Finally, it discusses the role of federal funding initiatives like the CHIPS Act, the need for workforce development in specialized fields, and the potential for collaboration between industry, academia, and government. The successful onshoring of advanced packaging is positioned as a critical enabler for the U.S. to maintain leadership in next-generation semiconductor technologies.

The full half-hour presentation is available at this link:
https://ieeetv.ieee.org/hbs/onshoring-advanced-packaging-in-the-united-states