Enabling AI Capability Through Chiplet Architecture
In this interview, Balaji Baktha, CEO and founder of Ventana Micro Systems, talks about the company’s progress since coming out of stealth just over two years ago.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Next-Gen AI Architecture Through Co-Packaged Optics
- Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities
- Chiplet Architecture for Next Gen Infrastructure
- Chiplet based Reconfigurable OCP Accelerator Module (OAM) architecture and platform
Latest Videos
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
- The State of Multi-Die: Insights and Customer Requirements
- Coding approaches for increasing reliability and energy efficiency of 3D technologies
- AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets