BGA (Ball Grid Array)
Ball Grid Array (BGA) is a popular surface-mount packaging technology for integrated circuits (ICs), known for its high-density interconnects, excellent electrical performance, and reliable thermal management.
A BGA package consists of:
- A chip or die mounted on a substrate
- An array of tiny solder balls on the underside
- Electrical connections between the die and the PCB through these solder balls
Unlike traditional leaded packages (like QFP or DIP), BGA replaces pins with solder balls, enabling more connections in a smaller area and improving signal integrity and heat dissipation.
Related Articles
- Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning
- 3D integration of pixel readout chips using Through-Silicon-Vias
- Efficient ESD Verification For 2.5/3D Automotive ICs
- Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators
Featured Content
- Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems
- Lifecycle Cost-Effectiveness Modeling for Redundancy-Enhanced Multi-Chiplet Architectures
- Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics
- DISTIL: A Distributed Spiking Neural Network Accelerator on 2.5D Chiplet Systems
- Building out the Photonic Stack
- Lightmatter Introduces Guide Light Engine for AI, Featuring VLSP Technology
- Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers
- Lightmatter Collaborates with Synopsys to Integrate Advanced Interface IP with Its Passage Co-Packaged Optics Platform
- Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure
- Hybrid Bonding Comes of Age Slowly and Collectively
- Tenstorrent Announces Participation in CHASSIS Program
- LIGENTEC and X-FAB Expand Integrated Photonics Offering with SOI and Thin-Film Lithium Niobate Volume Scaling