BGA (Ball Grid Array)
Ball Grid Array (BGA) is a popular surface-mount packaging technology for integrated circuits (ICs), known for its high-density interconnects, excellent electrical performance, and reliable thermal management.
A BGA package consists of:
- A chip or die mounted on a substrate
- An array of tiny solder balls on the underside
- Electrical connections between the die and the PCB through these solder balls
Unlike traditional leaded packages (like QFP or DIP), BGA replaces pins with solder balls, enabling more connections in a smaller area and improving signal integrity and heat dissipation.
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