JCET Opens New High-Density 3D System Integration Facility

June 4, 2026 -- On June 1, JCET officially opened its new facility for high-density 3D system integration at its Jiangyin manufacturing base, with the first batch of equipment moved in on the same day.

The new facility represents an important step in JCET’s ongoing expansion of advanced packaging capacity. The facility includes approximately 7,000 square meters of cleanroom space and is expected to achieve production line readiness by the end of this month. It will provide advanced packaging technologies and services for applications such as power modules for AI data centers, further strengthening JCET’s overall capabilities in high-density system integration.

JCET’s 3D system-in-package technology enables vertical integration of multiple chips and high-density interconnects. By significantly shortening current paths, improving power efficiency and optimizing thermal management, the technology provides a more efficient and reliable foundation for AI power modules.

“JCET has built deep expertise in power module assembly and test over many years,” said Quanbing Li, Vice President of JCET and General Manager of JCET Jiangyin Co., Ltd., “Through long-term collaboration with global customers, we have continued to refine our engineering capabilities across project introduction, process development, reliability validation and high-volume manufacturing. This has enabled us to provide one-stop services for highly complex products. With the opening of this new facility, we will further strengthen our capacity deployment for high-value applications such as AI power modules and provide customers with more stable and efficient manufacturing support.”