The 3D-IC Multiphysics Challenge Dictates A Shift-Left Strategy

Gleaning useful information well before all the details of an assembly are known.

By John Ferguson, Siemens Digital Industries Software (April 25, 2024)

As the industry marches forward in a 3D-IC centric design approach, we are facing a new problem. Sometimes referred to as “electro-thermal” or “electro-thermo-mechanical,” it really is the confluence of multiple forms of physics exerting impacts on both the physical manufacture and structure of these multi-die designs and their electrical behavior.

What are 3D-IC multiphysics effects

Put simply, we know that changes in temperatures impact electrical behavior of both wires and transistor-level devices. Similarly, mechanical stresses can also impact the circuitry behavior. When we think about the consequences of these combining issues, the implications are quite huge with respect to the long-held desire of a design environment where chiplets in the form of hard IP can be dropped in to a 3D heterogeneous design assembly and work out of the box. In fact, even the concept of known-good-die has to be rethought.

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