Machine Learning Applications in EDA for Chiplet Reliability
Learn how AI is transforming chip design and enhancing semiconductor reliability. In this webinar, leading researchers share insights into cutting-edge advancements in the field:
🔹 Dr. George Floros
🔹 Dr. Tahani Aladwani
🔹 Dr. Yixian Shen
🔹 Dr. Olympia Axelou
This webinar was part of COIN3D, a Horizon Europe Twinning project, co-funded by the European Union. It was organized in collaboration with:
🏛️ University of Thessaly
🏛️ University of Amsterdam
🏛️ University of Bremen
🏛️ University of Glasgow
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
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