Custom Tool Development Strategies for Chiplet Reliability

Watch the COIN-3D Webinar #2 – Custom Tool Development Strategies for Chiplet Reliability

In this session, we explored custom tool development strategies for enhancing the reliability of 2.5D and 3D chiplet-based architectures. Our expert speakers shared research insights, methodologies, and tool development experiences targeting critical challenges in semiconductor reliability.

📌 Contents of this video 📌
00:00 - Introduction
01:51 - CoMeT: Interval Thermal Simulator for 3D ICs
14:14 - Physical Hierarchy Exploration of 3-D ICs
42:25 - PROTON: Physics-Based Electromigration Assessment on Modern VLSI Power Grids
58:44 - Q&A Session

🎙️ Speakers:

•  Dr. George Floros – University of Thessaly
•  Dr. Anuj Pathania – University of Amsterdam
•  Dr. Olympia Axelou – University of Thessaly
•  Dr. Alberto Garcia-Ortiz – University of Bremen

🌐 COIN3D is a collaboration between:

• University of Thessaly
• University of Amsterdam
• University of Bremen
• University of Glasgow

💡 The project is co-funded by the European Union under the Horizon Europe programme.
🔗 Learn more: https://coin3d-project.eu