Chiplet Architecture for Next Gen Infrastructure
What's driving the deep interest in chiplet architecture? How does it scale, and is there a role for open interfaces?
Bapi Vinnakota, ODSA Project Lead from Open Compute Project explains:
- Chiplets are currently the fastest and most efficient way to build heterogenous systems, integrating different types of compute into one package. This is essential for accommodating the ever-changing AI workloads.
- The IO bandwidth, both into memory and in terms of raw network, needs to increase dramatically to keep up with the growing demands of data centers. Companies associated with the ODSA are working on solutions to this challenge.
- Open interfaces are believed to be the best way to integrate systems, creating composable systems that integrate chiplet devices from multiple vendors into one usable whole. This is a fundamental belief at the OCP and is key to meeting the requirements of future data centers, especially those with AI-intensive workloads.
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related Videos
- Architecting Next Generation Compute and I/O Chiplet for AI/ML, Cloud and Edge Platforms
- Rethinking chip(let) design for next generation ADAS applications
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
- Integrated Photonics for the Next Generation of Glass Core Substrates
Latest Videos
- Mark Papermaster at World Summit AI 2026 Talks Holistic Computing, Chiplets and AI Sovereignty
- Accelerating Chiplet SoC Development with Standards-Based Frameworks and Automated Design Flows
- Qualcomm's Tony Pialis on Dragonfly and the Data Movement Wall
- From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands
- Advancing 3DIC Technologies to Propel AI Innovations