Intel Demonstrates First Fully Integrated Optical I/O Chiplet for More Scalable AI
Intel‘s leading optical compute interconnect (OCI) chiplet addresses the emerging need for higher bandwidth, lower power and longer reach, enabling future AI scalability and novel compute architectures. The first 4 Tbps bidirectional OCI chiplet co-packaged with a concept CPU was showcased at OFC2024, demonstrating the maturity of Intel’s in-house, proven Silicon Photonics technology and platform.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Intel's Optical I/O Chiplet Co-Packaged with Server CPU
- Pat Gelsinger on the Universal Chiplet Interconnect Express (UCIe)
- Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities
- Architecting Next Generation Compute and I/O Chiplet for AI/ML, Cloud and Edge Platforms
Latest Videos
- The Evolution Of UCIe
- Blueprint for AI Hardware But with Instructions: Pre-Validated Chiplet Building Blocks
- Standardizing System-Level Interoperability for Multi-Vendor Chiplets
- Towards wafer-scale optical interconnect relying on Silicon Photonics and advanced 3D assembly
- Pre-Silicon Chiplet Verification for Datacenters