Advanced Packaging Techniques (Semi 101)

As Moore’s Law slows, advanced semiconductor packaging techniques are being adopted to integrate multiple chip types like logic, memory, and I/O into a single package, enhancing performance and cost-efficiency. This includes chiplet architectures, vertical die stacking connected by Through Silicon Vias (TSVs) with microbumps or hybrid bonding, and the use of interposers and substrates to manage dense connections.

Learn about advanced packaging techniques in this Semi 101 video and Lam's innovations that are enabling the precision, uniformity, and scalability required for this next generation in semiconductor manufacturing.