How to accelerate innovation in IC technology with chiplets and 3D ICs
Join us for an insightful listen with our podcast trailer featuring John McMillan, as we explore "The Future of IC Technology: 3D IC design and manufacturing." The integrated circuit (IC) industry is undergoing a remarkable transformation, and we will be covering it all.
What you'll get a sneak peek of:
- The driving forces behind 3D IC evolution: Understand the key trends reshaping IC technology, from miniaturization to the integration of complex functions through advanced packaging and 3D ICs.
- The $1 trillion market opportunity: Discover the immense growth projected for the IC industry by 2030 and the challenges companies face in accelerating innovation within this rapidly expanding market.
- Cost as a major driver. The Rise of Chiplets: Explore why cost is a significant factor in IC design and how chiplets offer a new, more affordable approach to designing integrated circuits.
Featured Speaker:
John McMillan: Technical Marketing Engineering Manager, Siemens Digital Industries Software
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related Videos
- Getting Moore with Less: How Chiplets and Open Interconnect Accelerate Cloud-Optimized AI Silicon
- Rapid Innovation with Chiplets and FPGAs
- Chiplets in 2029 and How We Got There
- 3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
Latest Videos
- The European Chip Ecosystem
- Scaling up AI Compute, Memory and Connectivity
- CURIE: A Cycle-Accurate and Synthesizable UCIe Interface for the Agile Design and Co-Simulation of Chiplets
- Federated Chiplet Design and Simulation
- Custom HBM as a System: Co-designing the Base Die, Die to Die Power, and Package Thermals for AI Accelerators