Cadence & Samsung: Chiplet Ecosystem Innovation for Edge AI | CadenceLive 2026

Watch this video featuring the groundbreaking collaboration between Cadence and Samsung Foundry as they shape the future of Edge AI and Physical AI through the innovative Physical AI Chiplet Platform. This presentation gives you a front-row seat to how these industry leaders are working together to revolutionize semiconductor design and transform the broader Chiplet Ecosystem. See how Cadence Chiplets and Samsung Foundry accelerate innovation, helping application teams reduce time-to-market and streamline complex multi-die design challenges. If you want to see firsthand how this strategic partnership is changing the game, this is a must-watch video.

** WHAT TO EXPECT IN THIS VIDEO ** 

Recorded at CadenceLive 2026, this insightful discussion features Mick Posner, Senior Group Director of Chiplet Solutions at Cadence, and Kevin Yee, Sr. Director of IP and Ecosystem Marketing at Samsung Foundry. Together, they dive deep into the groundbreaking collaboration aimed at advancing physical hardware solutions for next-generation applications.

The conversation highlights the upcoming tape-out of a real, silicon-based prototype platform scheduled for early 2027. Built on Samsung's automotive-grade SF5A technology, this platform combines a CPU chiplet, an AI accelerator (featuring the Cadence Neo NPU IP), and an advanced system chiplet. By offering a pre-verified solution, Cadence can rapidly configure and customize the reference design to meet the application specific customer design requirements of drones, robotics, ADAS, and industrial edge computing. 

You will also hear about the specialized framework required to manage system boot capabilities, security, debugging, and inter-chiplet communication. Whether you are looking to build a custom monolithic alternative or plug a custom die into an existing system, this partnership provides the essential building blocks for your next big breakthrough.