Advanced Semiconductor Packaging Explained: Hybrid Bonding, Chiplets & Manufacturing Innovation

Advanced semiconductor packaging is rapidly becoming the key driver of performance, cost efficiency, and scalability in modern computing systems.

In this episode of the Semiconductor Leadership Podcast, host Salah Nasri sits down with Dr. TK Lee, founder of Launch Tech and a semiconductor packaging pioneer with more than 140 U.S. patents, to explore the technologies shaping the future of chip manufacturing.

Dr. Lee shares insights from decades of experience across Texas Instruments, Micron, and global R&D labs, discussing how packaging has evolved from a backend process into a system-level engineering discipline enabling AI, high-performance computing, and heterogeneous integration.

The conversation dives into:

• Hybrid bonding and chiplet architectures
• Panel-level vs wafer-level packaging
• Manufacturing scalability and process stability
• Substrate innovation and materials engineering
• Reliability challenges in advanced packages
• The skills future semiconductor engineers must develop

Dr. Lee also explains why innovation, multidisciplinary engineering, and system-level thinking will determine which companies lead the next era of semiconductor manufacturing.