Automated Multiphysics for 3D IC Success
Challenges: power generates heat. Heat distorts wires and changes transistor behavior. A change in wires and transistors implies that initial power estimates were wrong.
More and more designers are moving to heterogeneous architectures. This comes with new challenges as compared to the 2D domain. Come learn how the Calibre team can help achieve successful 3D IC design goals.
Discover how Siemens’ Calibre team automates 3D IC design to conquer heat, stress, and complexity, with insights from Shetha Nolke and John Ferguson.
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