Automated Multiphysics for 3D IC Success
Challenges: power generates heat. Heat distorts wires and changes transistor behavior. A change in wires and transistors implies that initial power estimates were wrong.
More and more designers are moving to heterogeneous architectures. This comes with new challenges as compared to the 2D domain. Come learn how the Calibre team can help achieve successful 3D IC design goals.
Discover how Siemens’ Calibre team automates 3D IC design to conquer heat, stress, and complexity, with insights from Shetha Nolke and John Ferguson.
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related Videos
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
- Enabling a true open ecosystem for 3D IC design
- GTC '26 - Berlin | Long-running, multi-tool Fuse Agents for 3D IC workflows
- Zero trust in silicon: The new security imperative for chiplet-based 3D ICs
Latest Videos
- The European Chip Ecosystem
- Scaling up AI Compute, Memory and Connectivity
- CURIE: A Cycle-Accurate and Synthesizable UCIe Interface for the Agile Design and Co-Simulation of Chiplets
- Federated Chiplet Design and Simulation
- Custom HBM as a System: Co-designing the Base Die, Die to Die Power, and Package Thermals for AI Accelerators