Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
By Drew Weninger 1, Samuel Serna 2, Luigi Ranno 3, Lionel Kimerling 3 and Anuradha Agarwal 1
1 Massachusetts Institute of Technology, Cambridge, USA.
2 Bridgewater State University, Bridgewater, USA.
3 Massachusetts Institute of Technology, USA.
Abstract
In this paper, we provide an overview and comparison of devices used for optical waveguide-to-waveguide coupling including inter-chip edge couplers, grating couplers, free form couplers, evanescent couplers, cantilever couplers, and optical wirebonds. In addition, technology for efficient transmission of light through chips is discussed including guided mode and free form photonic vias for substrates including silicon, glass, and organics. The results are discussed in the context of potential applications including co-packaged optics switch packages, replaceable biochemical sensors, optically connected memory, optical computing, integrated quantum photonics, and integrated LiDAR systems to show possible improvements in energy efficiency, performance, and cost.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Technical Papers
- Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects
- Toward Digital Twins in 3D IC Packaging: A Critical Review of Physics, Data, and Hybrid Architectures
- Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics
- High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions
Latest Technical Papers
- Rethinking Compute Substrates for 3D-Stacked Near-Memory LLMDecoding: Microarchitecture–Scheduling Co-Design
- DeepStack: Scalable and Accurate Design Space Exploration for Distributed 3D-Stacked AI Accelerators
- Mapping Space Exploration for Multi-Chiplet Accelerators Targeting LLM Inference Serving Workloads
- Escaping Flatland: A Placement Flow for Enabling 3D FPGAs
- 3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment