Marvell Unveils Industry’s First 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm to Power Next Generation XPUs
2025-08-26 13:25:00
IP
Chiplet Recent Updates - Page 8 of 42
Xscape Photonics and Tower Semiconductor Unveil the Industry’s First Optically Pumped On-Chip Multi-Wavelength Laser Platform for AI Datacenter Fabrics
2025-08-25 11:34:00
Photonics
Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers
2025-08-25 05:50:00
Research & Development
NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium
2025-08-20 03:20:00
Other
Silicon 100: Chiplet work spanning interconnect PHYs to smart substrates
2025-08-18 12:29:00
Commentary / Analysis
Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
2025-08-15 05:49:00
Business
ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
2025-08-15 04:19:00
Business
OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
2025-08-14 05:47:00
Foundries
Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
2025-08-13 13:13:00
EDA
Celestial AI Closes Final Series C1 Round to Accelerate Next-Generation AI Computing
2025-08-13 12:58:00
Business
Rigetti Computing Reports Second Quarter 2025 Financial Results; Announces General Availability of its 36-Qubit Multi-Chip Quantum Computer
2025-08-13 08:43:00
Business
AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development
2025-08-12 15:12:00
Other
Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user
2025-08-12 13:14:00
EDA
Chiplet Interfaces Embrace Failures
2025-08-12 08:30:00
Commentary / Analysis
Open Compute Project Enables Silicon Diversity in AI Clusters
2025-08-07 07:05:00
Standards
UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance and Enhanced Manageability
2025-08-05 12:42:00
Standards
Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs
2025-08-05 03:59:00
Deals
Meeting the Cleaning Challenges of High-density 3D Heterogeneous Integration Applications
2025-08-04 13:24:00
Commentary / Analysis
Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions
2025-07-31 12:01:00
Commentary / Analysis
SiMa.ai Expands Strategic Collaboration with Synopsys to Accelerate Automotive AI Innovation
2025-07-30 15:16:00
EDA