JCET Launches Next-Generation Power Module Packaging and Test Solutions for AI Data Centers

June 9, 2026 -- JCET Group announced the launch of its next-generation high-density 3D power module packaging and test solutions designed for AI data center applications. Built on JCET’s XDPKG-3DSiP (3D system-in-package) technology, the new solution integrates high-density multilayer interconnects with three-dimensional module architecture to optimize power devices, passive components, interconnect structures and thermal paths within a compact package footprint. The solution enhances power density, energy efficiency, thermal performance and long-term reliability, providing a more efficient and stable foundation for AI computing infrastructure.

JCET Next-Generation High-Density 3D Power Module Packaging and Test Solutions

JCET provides turnkey packaging and test solutions spanning both power management ICs and power modules. At the wafer-level packaging stage, the company delivers highly consistent bumping services along with wafer-level processes tailored for power management ICs and DrMOS devices, establishing a strong foundation for subsequent system integration. Building on these capabilities, JCET further supports SiP module assembly and test, enabling a seamless progression from chip-level interconnects to fully integrated system-level modules.

To improve power conversion efficiency, JCET optimizes package structures, interconnect paths, parasitic effects and thermal pathways, while incorporating technologies such as copper pillar interconnects and high-density packaging. These capabilities enable power modules to achieve higher energy conversion efficiency under heavy-load conditions, helping customers enhance server system efficiency while reducing pressure on power delivery and thermal management systems. 

Reliability is a central focus of the new solution. By leveraging ECP substrates, copper pillar interconnects and a comprehensive lifecycle quality management system, JCET enhances the mechanical integrity and electrical stability of power modules under high-current-density operation, long-term heavy-load conditions, thermal cycling, power cycling and system-level thermal stress. These capabilities address the stringent requirements of AI data centers for sustained operation and high availability.

To increase power density, JCET applies multilayer stacking, multidimensional structural design, high thermal conductivity interface materials, top-side heat dissipation and vacuum reflow processes to enable higher levels of integration and more compact module designs. Under comparable thermal constraints and design conditions, the new solution achieves more than a 20 percent increase in power density compared with the previous generation of similar solutions. This allows limited rack and board-level space to support higher computing workloads, providing greater flexibility in AI server system design.

JCET further enhances customer development through advanced co-design and simulation capabilities. By building virtual digital prototypes and conducting coupled electrical, thermal and mechanical multiphysics analysis, the company enables early-stage optimization of power integrity, thermal management and structural reliability. This approach helps shorten development cycles and improve overall product robustness.

In markets centered on high-performance computing applications, JCET’s high-density power management business has experienced rapid growth since 2025. The company’s capabilities have been recognized by leading customers in China and internationally, and demand continues to show strong momentum.

Dr. Rebecca Chen, Vice President of JCET and General Manager of the AI & Smart Industry BU, said, “Drawing on our long-term investment and technical expertise in advanced packaging and system-level integration, JCET has developed a comprehensive portfolio of packaging and test solutions for AI data centers, covering computing, memory, connectivity and power. We continue to strengthen our capabilities across the AI data center value chain. Looking ahead, JCET will further leverage its one-stop solutions spanning co-design, system-level integration and test, together with its global manufacturing footprint, to work closely with customers and ecosystem partners worldwide and advance power management technologies for AI data centers.”