3D IC heterogeneous packaging
Victoria Martinez, Siemens EDA
As the demand for higher performance, lower power, and more complex systems grows, the semiconductor industry is shifting towards 3D IC and heterogeneous integration (HI) solutions to meet these challenges. These advanced architectures combine multiple dies, chiplets, and specialized accelerators into a single, scalable system.
In this video from DesignCon 2025, you’ll learn about what’s driving 3D IC and heterogeneous integration and how Innovator3D IC (i3D), our next-generation planning and verification platform, is revolutionizing the 3D IC design process.
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