The Chiplet Market Today and Where It's Headed
This is the main keynote presentation at the 2026 Chiplet Summit given by Objective Analysis’ Jim Handy. In this presentation, he gives an overview of chiplets and examines the market and technology factors driving its growth.
He addresses why chiplets are needed and being used today including the reticle limit when creating die as well as the ability to mix chiplets built on different wafer technologies. Chiplet architectures also allow decoupling of chip transistor processes.
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Videos
- Chiplet Market Today and Where We’re Headed
- DAC 2025: Cadence and Its Ambition to Jumpstart the Chiplet Marketplace
- The Rise of the Chiplet
- Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities
Latest Videos
- 2026 DRAM and Advanced Packaging Master Class
- Chiplets, RISC-V, and Europe's AI Silicon Ambition
- Driving the Future of Automotive Compute with UCIe
- A Physics-Informed Neural Network Surrogate for Runtime PDN and Dynamic Droop Prediction in 2.5-D Chiplet Integration
- A Chiplet Interface Model for System-Level PPA Exploration