On-Package Chiplet Innovations with UCIe
Dr. Debendra Das Sharma
Chair of UCIe Consortium
Intel Senior Felow and Chief Architect I/O Technologies and Standards, DCAI Grouo, Intel Corporation
By definition, chiplets need to be connected together to form a useful chip and one of the ways to do this is Universal Chiplet Interconnect Express (UCIe).
The latest version is UCIe3 that brings more functionality and faster transfer rates. UCIe can now deliver up to 64 G transfers/s. These on-chip interconnects are faster and more efficient than off-chip connections and multiple dies can be supported in a single chip package.
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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- On Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low-Power, High-Bandwith, Low-Latency and Low-Cost Approach
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