3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
How are 3D Integrated Circuits (3D ICs) revolutionizing semiconductor design, and what role do advanced packaging technologies play in this transformation?
In this episode of the Siemens EDA Podcast Series on 3D IC chiplet ecosystems, host John McMillan sits down with Jan Vardaman, President and Founder of TechSearch International, to discuss the latest advancements in 3D IC technology, heterogeneous integration, and advanced semiconductor packaging.
Jan shares insights on why 3D ICs are gaining traction, the key industry drivers behind their adoption, and how companies are overcoming integration challenges. She also explores the role of chiplets, AI-driven design processes, and supply chain shifts in shaping the future of semiconductor manufacturing.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Unpacking 3D IC microarchitecture: Challenges, solutions, and the future of chiplet design
- The hidden heat challenge of 3D IC: and what designers need to know
- From 2.5D to true 3D IC: What's driving the next wave of integration
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
Latest Videos
- Inside the AI Bottleneck: Data Movement, Chiplets, and System Scaling
- On-Package Chiplet Innovations with UCIe
- Advanced Semiconductor Packaging Explained: Hybrid Bonding, Chiplets & Manufacturing Innovation
- The Chiplet Market Today and Where It's Headed
- Advanced Packaging & Chiplet Design with Chipletz