3D IC Podcast | The future of 3D ICs: How advanced packaging is changing the industry
How are 3D Integrated Circuits (3D ICs) revolutionizing semiconductor design, and what role do advanced packaging technologies play in this transformation?
In this episode of the Siemens EDA Podcast Series on 3D IC chiplet ecosystems, host John McMillan sits down with Jan Vardaman, President and Founder of TechSearch International, to discuss the latest advancements in 3D IC technology, heterogeneous integration, and advanced semiconductor packaging.
Jan shares insights on why 3D ICs are gaining traction, the key industry drivers behind their adoption, and how companies are overcoming integration challenges. She also explores the role of chiplets, AI-driven design processes, and supply chain shifts in shaping the future of semiconductor manufacturing.
Related Chiplet
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- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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